Abstract
The effect of the polyethylene glycol(PEG) molecular weight(MW) upon via-hole filling with diameter of 50 μm and aspect ratio of 1 in the acid copper plating solution was studied.The cathodic polarization in copper electroplating bath with PEG of different molecule weights was investigated by linear sweep voltammetry.The surface roughness,crystallography,and the resistivity of copper films were characterized by X-ray diffraction(XRD),atomic force microscopy(AFM) and the four-point probe measurements.The results showed that the polarization on the cathode and the hole-filling capability of electroplating copper bath were increased evidently with an increase of PEG molecular weight from 600 to 8000.When the PEG MW was larger than 6000 in electroplating bath,a void-free filling was achieved.While the surface roughness,resistivity and crystallinity of plated Cu film were decreased with an increase of PEG molecular weight from 600 to 8000.
Keywords
copper electrodeposition, PEG, molecular weight, hole-filling, cathodic polarization, crystallinity
Publication Date
2008-11-28
Online Available Date
2008-11-28
Revised Date
2008-11-28
Received Date
2008-11-28
Recommended Citation
Lie YIN, Zeng-lin WANG.
Behavior of Copper Electrodeposition in Copper Electroplating Solution with Different PEG Molecular Weight[J]. Journal of Electrochemistry,
2008
,
14(4): 431-435.
DOI: 10.61558/2993-074X.1937
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol14/iss4/18
References
[1]Andricacos P C,Uzoh C,Dukovic J O,et al.Dama-scene copper electroplating for chip interconnections[J].IBM J Res Dev,1998,42(5):567.
[2]Kobayashi T,Kawasaki J,Kuniaki M,et al.Via-fillingusing electroplating for build-up PCBs[J].ElectrochimActa,2001,47:85.
[3]Dow W P,Huang H S,Lin Z.Interactions betweenbrightener and chloride ions on copper electroplating forlaser-drilled via-hole filling[J].Electrochem Solid-State Lett,2003,6(9):C134.
[4]Pasquale M A,Gassa L M,Arvia A J.Accelerator ag-ing effects during copper electrodeposition[J].Electro-chim Acta,2008,53:5891.
[5]Moffat TP,Baker B,Wheeler D,et al.Accelerator ag-ing effects during copper electrodeposition[J].Electro-chem Solid-State Lett,2003,6(9):C59.
[6]Feng Z V,Li X,Gewirth AA.Inhibition due to the in-teraction of polyethylene glycol,chloride,and copper inplating baths:a surface-enhanced Raman study[J].Phys Chem B,2003,107:9415.
[7]DowW P,Yen MY,Lin W B,et al.Influence of mo-lecular weight of polyethylene glycol on microvia fillingby copper electroplating[J].Electrochem Soc,2005,152(11):C769.
[8]Willey M J,West A C.Microfluidic studies of adsorp-tion and desorption of polyethylene glycol during copperelectrodeposition[J].Electrochem Soc,2006,153(10):C728.
[9]Stelter M,Bombach H,Nesterov N.Using polyethyleneglycols as alternative inhibitors in copper electrorefining[J].Journal of the Minerals,Metals and Materials So-ciety,2002,54:32.
[10]Hebert K R,Adhikari S,Houser J E.Chemical mech-anism of suppression of copper electrodeposition by po-ly(ethylene glycol)[J].Electrochem Soc,2005,152(5):C324.
[11]Vas’ko V A,Tabakovic I,Riemer S C.Effect of or-ganic additives on structure,resistivity,and room-tem-perature recrystallization of electrodeposited copper[J].Microelectron Eng,2004,75:71.
[12]Hasegawa M,Nonaka Y,Negishi Y,et al.Enhance-ment of the ductility of electrodeposited copper films byroom-temperature recrystallization[J].ElectrochemSoc,2006,153(2):C117.
[13]Jiang H Y,Liu Z J,Wang X W,et al.Effect of tri-ethanolamine on deposition rate of electroless copperplating[J].Transactions of the Institute of Metal Fin-ishing,2007,85(2):103.
Included in
Engineering Science and Materials Commons, Materials Chemistry Commons, Materials Science and Engineering Commons, Physical Chemistry Commons
