Behavior of Copper Electrodeposition in Copper Electroplating Solution with Different PEG Molecular Weight

Authors

Lie YIN, Key Laboratory of Applied Surface and Colloid Chemistry(Shaanxi Normal University),Ministry of Education,School of Chemistry & Materials Science,Shaanxi Normal University,Xi'an,710062,China;
Zeng-lin WANG, Key Laboratory of Applied Surface and Colloid Chemistry(Shaanxi Normal University),Ministry of Education,School of Chemistry & Materials Science,Shaanxi Normal University,Xi'an,710062,China;

Corresponding Author

Zeng-lin WANG(wangzl@snnu.edu.cn)

Abstract

The effect of the polyethylene glycol(PEG) molecular weight(MW) upon via-hole filling with diameter of 50 μm and aspect ratio of 1 in the acid copper plating solution was studied.The cathodic polarization in copper electroplating bath with PEG of different molecule weights was investigated by linear sweep voltammetry.The surface roughness,crystallography,and the resistivity of copper films were characterized by X-ray diffraction(XRD),atomic force microscopy(AFM) and the four-point probe measurements.The results showed that the polarization on the cathode and the hole-filling capability of electroplating copper bath were increased evidently with an increase of PEG molecular weight from 600 to 8000.When the PEG MW was larger than 6000 in electroplating bath,a void-free filling was achieved.While the surface roughness,resistivity and crystallinity of plated Cu film were decreased with an increase of PEG molecular weight from 600 to 8000.

Keywords

copper electrodeposition, PEG, molecular weight, hole-filling, cathodic polarization, crystallinity

DOI Link

https://doi.org/10.61558/2993-074X.1937

Publication Date

2008-11-28

Online Available Date

2008-11-28

Revised Date

2008-11-28

Received Date

2008-11-28

Recommended Citation

Lie YIN, Zeng-lin WANG. Behavior of Copper Electrodeposition in Copper Electroplating Solution with Different PEG Molecular Weight[J]. Journal of Electrochemistry, 2008 , 14(4): 431-435.
DOI: 10.61558/2993-074X.1937
Available at: https://jelectrochem.xmu.edu.cn/journal/vol14/iss4/18