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Corresponding Author

Fang-Zu Yang(fzyang@xmu.edu.cn);
Dong-Ping Zhan(dpzhan@xmu.edu.cn)

Abstract

A novel cyanide-free gold sulfite process is introduced in this paper. In the bath, chloauric acid was directly employed as the main salt, and hydroxyethylidene diphosphonic acid (HEDP) was used as the stabilizer and coating grain refiner. The bath stability, the gold coating morphology and the mechanism of gold electrodeposition were studied in detail. The results showed that HEDP could significantly improve the bath stability. Moreover, the grains of the gold coating obtained from the gold sulfite bath without HEDP was rod-like, which grew gradually with the increasing of the deposition time, resulting in that the appearance of the coating turned from a golden yellow to a hazy reddish brown by the increase of the coating thickness. As HEDP was introduced into the gold sulfite bath, the gold grains were transformed to pyramidal, and the grain growth rate accompanying the increase of the coating thickness was much slower than that in the gold sulfite bath without HEDP, observing the golden bright appearance within 1 μm thickness. Electrochemical curves indicated that gold electrodeposition did not undergo a nucleation stage.

Graphical Abstract

Keywords

cyanide-free gold plating, gold sulfite, hydroxyethylidene diphosphonic acid, electrodeposition, gold coating

Publication Date

2022-07-28

Online Available Date

2022-03-17

Revised Date

2022-03-01

Received Date

2022-01-07

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