Volume 28, Issue 7 (2022) Special Issue on Electronic Electroplating（Ⅱ）

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Preface to Special Issue on Electronic Electroplating
Zhi-Dong Chen, Chong Wang, Wei He, and Ming Li

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Author Spotlight

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Electrodeposition of Functional Epitaxial Films for Electronics
Kui Huang, Rong-Jiao Huang, Su-Qin Liu, and Zhen He

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Research Progress in Electroless Cobalt Plating and the Bottom-up Filling of Electroless Plating
Yu Shen, Bing-Bing Li, Yi Ma, and Zeng-Lin Wang

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Research Progress of Copper Electrodeposition Filling Mechanism in Silicon Vias
Yun-Na Sun, Yong-Jin Wu, Dong-Dong Xie, Han Cai, Yan Wang, and Gui-Fu Ding

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Mechanism and Application of Nickel Nano-Cone by Electrodeposition on a Flexible Substrate
Xiu-Ren Ni, Ya-Ting Zhang, Chong Wang, Yan Hong, Yuan-Ming Chen, Yuan-Zhang Su, Wei He, Xian-Ming Chen, Ben-Xia Huang, Zhen-Lin Xu, Yi-Feng Li, Neng-Bin Li, and Yong-Jie Du

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Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution
Xiao-Li Wang, Wei He, Xian-Ming Chen, Hong Zeng, Yuan-Zhang Su, Chong Wang, Gao-Sheng Li, Ben-Xia Huang, Lei Feng, Gao Huang, and Yuan-Ming Chen

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Electrodeposition Mechanism and Process of a Novel Cyanide-Free Gold Sulfite Bath
Jia-Qiang Yang, Lei Jin, Wei-Qing Li, Zhao-Yun Wang, Fang-Zu Yang, Dong-Ping Zhan, and Zhong-Qun Tian

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Electrochemical Deposition of Copper Pillar Bumps with High Uniformity
Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, and Ji-Ye Luo

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Investigation of Through-Hole Copper Electroplating with Methyl Orange as A Special Leveler
Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, and Yuan-Ming Chen