Volume 28, Issue 7 (2022) Special Issue on Electronic Electroplating (Ⅱ)
Preface
Preface to Special Issue on Electronic Electroplating
Zhi-Dong Chen, Chong Wang, Wei He, and Ming Li
Author Spotlight
Reviews
Electrodeposition of Functional Epitaxial Films for Electronics
Kui Huang, Rong-Jiao Huang, Su-Qin Liu, and Zhen He
Research Progress in Electroless Cobalt Plating and the Bottom-up Filling of Electroless Plating
Yu Shen, Bing-Bing Li, Yi Ma, and Zeng-Lin Wang
Research Progress of Copper Electrodeposition Filling Mechanism in Silicon Vias
Yun-Na Sun, Yong-Jin Wu, Dong-Dong Xie, Han Cai, Yan Wang, and Gui-Fu Ding
Articles
Mechanism and Application of Nickel Nano-Cone by Electrodeposition on a Flexible Substrate
Xiu-Ren Ni, Ya-Ting Zhang, Chong Wang, Yan Hong, Yuan-Ming Chen, Yuan-Zhang Su, Wei He, Xian-Ming Chen, Ben-Xia Huang, Zhen-Lin Xu, Yi-Feng Li, Neng-Bin Li, and Yong-Jie Du
Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution
Xiao-Li Wang, Wei He, Xian-Ming Chen, Hong Zeng, Yuan-Zhang Su, Chong Wang, Gao-Sheng Li, Ben-Xia Huang, Lei Feng, Gao Huang, and Yuan-Ming Chen
Electrodeposition Mechanism and Process of a Novel Cyanide-Free Gold Sulfite Bath
Jia-Qiang Yang, Lei Jin, Wei-Qing Li, Zhao-Yun Wang, Fang-Zu Yang, Dong-Ping Zhan, and Zhong-Qun Tian
Electrochemical Deposition of Copper Pillar Bumps with High Uniformity
Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, and Ji-Ye Luo
Investigation of Through-Hole Copper Electroplating with Methyl Orange as A Special Leveler
Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, and Yuan-Ming Chen
Guest Editor
Ming Li,Shanghai Jiao Tong University Email:mingli90@sjtu.edu.cn
Cover Designers
Yun-Na Sun,Shanghai Jiao Tong
University
Email:Cecilia_Sun@sjtu.cn
Gui-Fu Ding,Shanghai Jiao Tong
University
Email:gfding@sjtu.edu.cn
