Studies on Sulfate Reducing Bacteria Influenced Corrosion of 90/10 Cu/Ni Alloy

Authors

Guang-zhou LIU, Qingdao Branch of Luoyang Ship Material Research Institute,Qingdao 266071,China;
Jian-hua QIAN, Qingdao Branch of Luoyang Ship Material Research Institute,Qingdao 266071,China;
Yan MA, Qingdao Branch of Luoyang Ship Material Research Institute,Qingdao 266071,China;
Jian-hua WU, Qingdao Branch of Luoyang Ship Material Research Institute,Qingdao 266071,China;

Corresponding Author

Guang_zhou LIU

Abstract

Electrochemical techniques such as measurements of corrosion potential,the polarization resistance,and potentiodynamic scanning technique were used to investigate the electrochemical behavior of 90/10 Cu/Ni alloy in Postgate C medium containing sulfate reducing bacteria(SRB).The results showed that the corrosion potential of the alloy changed from -0.20 to -0.75 V(SCE) when bacteria inocula was added, and the polarization resistance R p decreased obviously,which corresponds to an increased corrosion rate. The shape ofthe anodic polarization curves was drastically changed in the presence of SRB, and an active_passive transition was observed. Electron probe microanalyzer was used to investigate the morphology and chemical composition of the corroded surface. The results showed that the dealloying of nickel and iron from the alloy happened,and the morphology was spongy. Based on these studies, a mechanism of SRB_influenced corrosion of the alloy was proposed.

Keywords

Copper_nickel alloy, Microbiologically influenced corrosion (MIC), Sulfate reducing bacteria(SRB)

DOI Link

https://doi.org/10.61558/2993-074X.3287

Publication Date

2002-05-28

Online Available Date

2002-05-28

Revised Date

2002-05-28

Received Date

2002-05-28

Recommended Citation

Guang-zhou LIU, Jian-hua QIAN, Yan MA, Jian-hua WU. Studies on Sulfate Reducing Bacteria Influenced Corrosion of 90/10 Cu/Ni Alloy[J]. Journal of Electrochemistry, 2002 , 8(2): Article 13.
DOI: 10.61558/2993-074X.3287
Available at: https://jelectrochem.xmu.edu.cn/journal/vol8/iss2/13

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