Application of Electrolessplating Technology in Interconnection Manufacturing of Ultralarge-scale Integration

Authors

Zeng-lin WANG, *1),LIU Zhi-juan~(1),JIANG Hong-yan~(1),WANG Xiu-wen~1,Shoso Shingubara~(2)(1.School of Chemistry and Materials Science,Shaanxi Normal University,Xi'an 710062,Shaanxi,China,2.Faculty of Engineering,Kansai University,Osaka,564-8680,Japan;

Abstract

In this paper,research progresses in electroless plating for damascene copper process were reviewed.Electroless nickel ternary alloy deposition for barrier layer and electroless copper plating for seed layer were presented.Bottom-up copper fill high-aspect-via-hole and electroless plating after ICB-Pd catalytic layer for seed layer were mainly introduced.The applications of electroless plating in ultralarge-scale integration were discussed,and the developing tendency was also suggested.

Keywords

Electroless copper plating, Bottom-up fill, Damascene copper interconnection, Seed layer, Barrier layer

DOI Link

https://doi.org/10.61558/2993-074X.1710

Publication Date

2006-05-28

Online Available Date

2006-05-28

Revised Date

2006-05-28

Received Date

2006-05-28

Recommended Citation

Zeng-lin WANG. Application of Electrolessplating Technology in Interconnection Manufacturing of Ultralarge-scale Integration[J]. Journal of Electrochemistry, 2006 , 12(2): 125-133.
DOI: 10.61558/2993-074X.1710
Available at: https://jelectrochem.xmu.edu.cn/journal/vol12/iss2/2

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