Investigation of Through-Hole Copper Electroplating with Methyl Orange as A Special Leveler

Authors

Jia-Ying Xu, 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China;
Shou-Xu Wang, 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China;2. Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd and Zhuhai Founder Sci-Tech Multilayer Circuit Board Co., Ltd., Zhuhai 519175, Guangdong, China;
Yuan-Zhang Su, 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China;
Yong-Jie Du, 3. Zhuhai Dynamic Technology Optical Industry Co., Ltd, Zhuhai 519050, Guangdong, China;
Guo-Dong Qi, 4. GCI Science & Technology（Zhuhai）Co., Ltd, Zhuhai 519175, Guangdong, China;
Wei He, 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China;2. Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd and Zhuhai Founder Sci-Tech Multilayer Circuit Board Co., Ltd., Zhuhai 519175, Guangdong, China;
Guo-Yun Zhou, 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China;
Wei-Hua Zhang, 2. Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd and Zhuhai Founder Sci-Tech Multilayer Circuit Board Co., Ltd., Zhuhai 519175, Guangdong, China;
Yao Tang, 2. Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd and Zhuhai Founder Sci-Tech Multilayer Circuit Board Co., Ltd., Zhuhai 519175, Guangdong, China;
Yu-Yao Luo, 2. Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd and Zhuhai Founder Sci-Tech Multilayer Circuit Board Co., Ltd., Zhuhai 519175, Guangdong, China;
Yuan-Ming Chen, 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China;2. Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd and Zhuhai Founder Sci-Tech Multilayer Circuit Board Co., Ltd., Zhuhai 519175, Guangdong, China;Follow

Corresponding Author

Yuan-Ming Chen(ymchen@uestc.edu.cn)

Abstract

Methyl Orange (MO) with two kinds of functional groups can act as both an accelerator and an inhibitor, which has been used as a special leveler to simplify the electroplating additive system in the through-hole (TH) copper electroplating experiments. In this work, the role of MO in TH electroplating is characterized by molecular dynamics simulations and quantum chemical calculations. It is suggested that MO can spontaneously flatten the copper surface and be well adsorbed on the cathode surface, which inhibit the copper electrodeposition on the cathode. Electrochemical behavior of MO was evaluated by galvanostatic measurements (GM) and cyclic voltammetry (CV) to confirm that MO hardly affects the potential due to its duel functions of depolarizing and polarizing effects from the molecular structure of sulfonic acid group and other groups to achieve the internal Cu2+ reduction acceleration and mass transfer inhibition. Throw power value of TH with the aspect ratio of 10:1 could reach 92.34% from the base plating solution bath with the additions of only EO/PO and MO. The study of MO could provide new ideas for the development of electroplating additive system.

Graphical Abstract

Keywords

copper electroplating, through-hole, additive, methyl orange

DOI Link

https://doi.org/10.13208/j.electrochem.2213003

Publication Date

2022-07-28

Online Available Date

2022-05-24

Revised Date

2022-04-10

Received Date

2022-03-04

Recommended Citation

Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, Yuan-Ming Chen. Investigation of Through-Hole Copper Electroplating with Methyl Orange as A Special Leveler[J]. Journal of Electrochemistry, 2022 , 28(7): 2213003.
DOI: 10.13208/j.electrochem.2213003
Available at: https://jelectrochem.xmu.edu.cn/journal/vol28/iss7/8

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