The Electroless Plating Ni-Fe-P Alloy and Its Voltammetric Behavior

Authors

Sen-lin WANG, College of Materials Science and Engineering, Huaqiao University, Quanzhou 362011, ChinaFollow
Hui-huang WU, State Key Laboratory for Physical Chemistry of Solid Surface, Department of Chemistry, Xiamen university, Xiamen 361005, China

Corresponding Author

Sen-lin WANG(slwang@hqu.edu.cn)

Abstract

Electroless Ni-Fe-P alloy deposition from an alkaline bath, containing sodium hypophosphite as reducer, boric acid as buffer agent and sodium citrate as complexing agent, was investigated. To increase the plating rate and to inprove the bath stability, the deposition parameters were optimized. The effects of process parameters (pH, temperature and mole ratio of [Fe²⁺]/([Ni²⁺]+[Fe²⁺]) on the plating rate and deposit composition were examined and it was found that the presence of ferrous sulfate in the bath has an inhibitory effect on the alloy deposition. As a consequence, the percentage of iron in the electroless Ni-Fe-P alloys never reaches high values which is lower 20.0%. Using cyclic voltammetry the electrodeposition mechanism of Ni-Fe-P alloys was investigated. It was observed that the presence of ferrous sulfate in the bath decreases the deposition rate and the iron doesn′t catalyst on the oxidation of hypophosphite. However, the increase in temperature or pH leads to improving the deposition rate.

Keywords

Electroless deposition, Ni-Fe-P alloys, Cyclic voltammetry

DOI Link

https://doi.org/10.61558/2993-074X.3317

Publication Date

2003-08-28

Online Available Date

2003-08-28

Revised Date

2003-03-20

Received Date

2003-03-10

Recommended Citation

Sen-lin WANG, Hui-huang WU. The Electroless Plating Ni-Fe-P Alloy and Its Voltammetric Behavior[J]. Journal of Electrochemistry, 2003 , 9(3): 327-325.
DOI: 10.61558/2993-074X.3317
Available at: https://jelectrochem.xmu.edu.cn/journal/vol9/iss3/16