Abstract
By combing the computer processing system (including the design of the line and the pattern, the choice of the scanning area and the treatment of the activation) with the electroless-plating technology, this article provides a new approach for the micro-plating based on the ceramics. The copper film based on ceramics with good properties can be obtained under the mild operating conditions. The line resolution is 35 μm and the wiring speed is 50 mm/s. The results had also showed that the quality of the copper plating is closely related to the roughness of the ceramic substrates.
Keywords
Ceramic substrates, Computer management system, Micro-plating, Electroless copper plating
Publication Date
2005-02-28
Online Available Date
2005-02-28
Revised Date
2005-02-28
Received Date
2005-02-28
Recommended Citation
Zhi-jun GU.
Study on the New Technique of Cu Micro-plating Based on Ceramics[J]. Journal of Electrochemistry,
2005
,
11(1): 42-45.
DOI: 10.61558/2993-074X.1611
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol11/iss1/8
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