Corresponding Author

Han wei HE


Influence of medium pH value and passivator concentrations on the copper passivation and CMP process were studied by electrochemical measurement technologies, relations of the film thickness and tightness with polishing process and polishing rates were investigated. Electrochemical variables influencing polishing process and rates were found out. Electochemical mechanism of polishing processes were explained by corrosion potential and corrosion current density. A recipe of K 3 as passivator and nano sized γ Al 2O 3 as abrasives in medium of NH 3·H 2O solution was confirmed reasonable. It is shown that the conditions of polishing process to be controlled are 10 psi and 300 r/min.


Copper CMP, Electrochemical Behaviour

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