Copper Electrodeposition Under the Perturbation of Hard Particles

Authors

Zeng-wei ZHU, Research Center for Nontraditional Machining,Nanjing University of Aeronautics & Astronautics,Nanjing 210016,China;
Di ZHU, Research Center for Nontraditional Machining,Nanjing University of Aeronautics & Astronautics,Nanjing 210016,China;

Corresponding Author

Zeng-wei ZHU

Abstract

Copper electrodepositon was carried out on the rotating cathode,with hard particles(such as ceramic beads) filling between the electrodes.The rotation of cathode led hard particles to polish and impact the surface of deposit during electrodeposition.Copper deposits with a mass of cuspidal nodules were produced in acid sulfate solutions while brittle deposits without nodules were produced in alkaline sulfate solutions.It was also found that brightening and smoothing deposit could be obtained from the alkaline solution,and the deposit was approximatively disordered orientation with granular morphology of about 100~300 nm.The results show that the polishing and impact of hard particles can effectively disturb the discharge of cations,simultaneously influence the microstructure of deposits.

Keywords

Electrodeposition, Electroforming, Rotating cathode, Hard particle, Copper

DOI Link

https://doi.org/10.61558/2993-074X.1678

Publication Date

2005-11-28

Online Available Date

2005-11-28

Revised Date

2005-11-28

Received Date

2005-11-28

Recommended Citation

Zeng-wei ZHU, Di ZHU. Copper Electrodeposition Under the Perturbation of Hard Particles[J]. Journal of Electrochemistry, 2005 , 11(4): 412-415.
DOI: 10.61558/2993-074X.1678
Available at: https://jelectrochem.xmu.edu.cn/journal/vol11/iss4/11

References

[1]McGeough J A,LeuM C,RajurkarK P,et al.E lectrofor-m ing process and application to m icro/macro manufactur-ing[J]Annals of the CIRP.2001,50(2):499~514.
[2]Zhu D,Qu N S,Chan K C.Developm ent of joint elec-troform ing[J].Technology Journal ofM aterials Process-ing Technology,1997,63:844~847.
[3]Sole M ichael J,Szendre i Thom as.E lectroform ed coppershaped charge liners[J].Proc.AESF Annu.Tech.Conf.,1991,78 th:423~47.
[4]PrThangavelu,Veeramani P,Srinivasan K N,et.al.Copperelectroform ing of cryogenic upper stage main engine[J].Bulletin of Electrochem istry,2000,16(11):493~496.
[5]Tony Hart,A lec W atson.E lectroform ing[J].M etalF in ish ing,2000,98(1):388~399.
[6]S ilaim an i S M,John S.Review on recent advances in e-lectroform ing during the last decade[J].Bu lletin of E-lectrochem istry,2001,17(12):553~560.
[7]LIM inghua(李铭华),YUAN Sh ipu(袁诗璞),et al.H igh Speed E lectrop lating[M].S ichuan:S ichuan Peo-p le's Pub lish House,1980,6~45.
[8]XU Shukai(许书楷),YANG Fangzu(杨防祖),ZHOU Shaom in(周绍民).E ffect of deposition cond i-tions on the texture of zincdeposition[J].E lectrochem-istry,1995,1(4):408~414.
[9]GU M in(辜敏),YANG Fangzu(杨防祖),HUANGL ing(黄令),et al.XRD study on h ighly preferred ori-entation Cu electrodeposit[J].E lectrochem istry,2002,8(3):283~287.
[10]ZHOU Shaom in(周绍民).E lectrodeposition ofM etal—Princ ip le and M ethods[M].Shanghai:ShanghaiPress of Sc ience and Technology,1987:242~290.
[11]FEI Jingyin(费敬银),X IN W en li(辛文利),LIANGGuozheng(梁国正),et al.E ffects of ethylened iam inein copper brush p lating solution[J].Surface technolo-gy,2003,32(5):34~47.
[12]B IN Shengwu(宾胜武).B rush P lating Technology[M].Be ijing:Chem ical Industry Press,2003,140.