Copper Electrodeposition Under the Perturbation of Hard Particles

Authors

Zeng-wei ZHU, Research Center for Nontraditional Machining,Nanjing University of Aeronautics & Astronautics,Nanjing 210016,China;
Di ZHU, Research Center for Nontraditional Machining,Nanjing University of Aeronautics & Astronautics,Nanjing 210016,China;

Corresponding Author

Zeng-wei ZHU

Abstract

Copper electrodepositon was carried out on the rotating cathode,with hard particles(such as ceramic beads) filling between the electrodes.The rotation of cathode led hard particles to polish and impact the surface of deposit during electrodeposition.Copper deposits with a mass of cuspidal nodules were produced in acid sulfate solutions while brittle deposits without nodules were produced in alkaline sulfate solutions.It was also found that brightening and smoothing deposit could be obtained from the alkaline solution,and the deposit was approximatively disordered orientation with granular morphology of about 100~300 nm.The results show that the polishing and impact of hard particles can effectively disturb the discharge of cations,simultaneously influence the microstructure of deposits.

Keywords

Electrodeposition, Electroforming, Rotating cathode, Hard particle, Copper

DOI Link

https://doi.org/10.61558/2993-074X.1678

Publication Date

2005-11-28

Online Available Date

2005-11-28

Revised Date

2005-11-28

Received Date

2005-11-28

Recommended Citation

Zeng-wei ZHU, Di ZHU. Copper Electrodeposition Under the Perturbation of Hard Particles[J]. Journal of Electrochemistry, 2005 , 11(4): 412-415.
DOI: 10.61558/2993-074X.1678
Available at: https://jelectrochem.xmu.edu.cn/journal/vol11/iss4/11