•  
  •  
 

Abstract

Using cathodic hydrogen bubbles as a template,the three-dimensional(3-D) porous copper films have been successfully electrodeposited from a bath of 0.2 mol·dm~(-3) CuSO_(4) and 1.5 mol·dm~(-3) H_(2)SO_(4),effects of deposition parameters including temperature,current density and additives(Na_(2)SO_(4),HCl and Polyethylene glycol(PEG)) on the morphologies of the deposits have been systematically studied.SEM results showed that both the pore size and thickness of the pore walls decreased with cooling the electrolyte temperature or adding(Na_(2)SO_(4)) or PEG into the bath when the other deposition parameters were fixed.With addition small amounts of HCl in the bath,the wall structures of the films could be profoundly changed by refining the copper grains and reducing the branch growth.HCl and PEG coexisting in the bath resulted in more compact structure in the pore wall.The cyclic voltammetry(CV) of electro oxidation of methanol on the 3-D porous copper films in 0.5 mol·dm~(-3) NaOH + 0.25mol·dm~(-3) methanol revealed that the current density peak of methanol oxidation reached about 100 mA·cm~(-2), which is larger almost 20 times than that on the smooth copper electrode.

Keywords

Hydrogen bubble template, Electrodeposition, Porous copper

Publication Date

2006-05-28

Online Available Date

2006-05-28

Revised Date

2006-05-28

Received Date

2006-05-28

References

[1]Banhart J.M anufacture,characterization and app lica-tion of cellu larm etals and m etal foam s[J].Prog.M a-ter.Sc i.,2001,46:559~632.
[2]B rown I J,Sotiropou los S.E lectrodeposition of N i froma h igh internal phase emu lsion(H IPE)temp late[J].E lectroch im.Acta,2001,46:2711~2720.
[3]Nelson P A,Owen J R.A h igh-perform ance superca-pac itor/battery hybrid incorporating temp lated m eso-porous electrodes[J].J.E lectrochem.Soc.,2003,150(10):A1313~A1317.
[4]Attard G S,Bartlett P N,Colem an N R B,et al.M eso-porous p latinum film from lyotrop ic liqu id crystallinephase[J].Sc ience,1997,278:838~840.
[5]Sheela G,Pushpavanam M,Pushpavanam S.Z inc-n ickel alloy electrodeposits for water electrolysis[J].Int.J.Hydrogen Energy,2002,27:627~633.
[6]Sh in H C,Dong J,L iu M.Nanoporous structures pre-pared by an electrochem ical deposition process[J].Adv.M ater.,2003,15(19):1610~1613.
[7]Sh in H C,L iu M.Copper foam structures w ith h ighlyporous nanostructured walls[J].Chem.M ater.,2004,16:5460~5464.
[8]Sh in H C,L iu M.Three-d im entional porous copper-tinalloy electrodes for rechargeab le lith ium batteries[J].Adv.Funct.M ater.,2005,15:582~586.
[9]Acharya A,U lbrech J J.Note on the influence of vis-coelastic ity on the coalescence rate of bubb les and drops[J].A lChE J.,1978,24(2):348~351.
[10]Hahn P S,Slattery J C.E ffects of surface viscositieson the stab ility of a drain ing p lane parallel liqu id filmas a sm all bubb le approaches a liqu id-gas interface[J].A lChE J.,1985,31(6):950~956.
[11]Kristof P,PritzkerM.E ffect of electrolyte compositionon the dynam ics of hydrogen gas bubb le evolution atcopper m icroelectrodes[J].J.App l.E lectrochem.,1997,27:255~265.
[12]Craig V S J,N inham B W,Pashley R M.E ffect of e-lectrolytes on bubb le coalescence[J].Nature,1993,364(22):317~319.
[13]M iklavic S J.Deform ation of flu id interfaces underdoub le-layer forces stab ilizes bubb le d ispersions[J].Phys.Rev.E,1996,54:6551~6556.
[14]Deschenes L A,Barrett J,Mu ller L J,et al.,Inh ib i-tion of bubb le coalescence in aqueous solutions.1.e-lectrolytes[J].J.Phys.Chem.B,1998,102:5115~5119.
[15]Hofm e ierU,Yam insky V V,Christenson H K.Obser-vations of solute effects on bubb le form ation[J].J.Colloid Interface Sc i.,1995,174:199~210.
[16]Tantavichet N,PritzkerM D.E ffect of p lating mode,th iourea and chloride on the morphology of copper de-posits produced in ac id ic su lphate solutions[J].E lec-troch im.Acta,2005,50:1849~1861.
[17]Bonou L,Eyraud M,Denoyel R,et al.Influence ofadd itives on Cu electrodeposition m echan ism s in ac idsolution:d irect current study supported by non-electro-chem ical m easurem ents[J].E lectroch im.Acta,2002,47:4139~4148.
[18]Zahradnm J,Kuncova k G,F ialova M.The effect ofsurface active add itives on bubb le coalescence and gasholdup in viscous aerated batches[J].Chem.Eng.Sc i.,1999,54:2401~2408.
[19]Kang M C,Gew irth A A.Voltamm etric and forcespectroscop ic exam ination of oxide form ation on Cu(Ⅲ)in basic solution[J].J.Phys.Chem.B,2002,106:1211~1220.
[20]HeliH,Jafarian M,M ahjan iM G,Gob le F.E lectro-oxidation of m ethanol on copper in alkaline solution[J].E lectroch im i.Acta,2004,49:4999~5006.
[21]Paix o T R L C,Corbo D,BertottiM.Amperom etricdeterm ination of ethanol in beverages at copper elec-trodes in alkaline m ed ium[J].Anal.Ch im.Acta,2002,472:123~131.

Share

COinS
 
 

To view the content in your browser, please download Adobe Reader or, alternately,
you may Download the file to your hard drive.

NOTE: The latest versions of Adobe Reader do not support viewing PDF files within Firefox on Mac OS and if you are using a modern (Intel) Mac, there is no official plugin for viewing PDF files within the browser window.