Abstract
Using cathodic hydrogen bubbles as a template,the three-dimensional(3-D) porous copper films have been successfully electrodeposited from a bath of 0.2 mol·dm~(-3) CuSO_(4) and 1.5 mol·dm~(-3) H_(2)SO_(4),effects of deposition parameters including temperature,current density and additives(Na_(2)SO_(4),HCl and Polyethylene glycol(PEG)) on the morphologies of the deposits have been systematically studied.SEM results showed that both the pore size and thickness of the pore walls decreased with cooling the electrolyte temperature or adding(Na_(2)SO_(4)) or PEG into the bath when the other deposition parameters were fixed.With addition small amounts of HCl in the bath,the wall structures of the films could be profoundly changed by refining the copper grains and reducing the branch growth.HCl and PEG coexisting in the bath resulted in more compact structure in the pore wall.The cyclic voltammetry(CV) of electro oxidation of methanol on the 3-D porous copper films in 0.5 mol·dm~(-3) NaOH + 0.25mol·dm~(-3) methanol revealed that the current density peak of methanol oxidation reached about 100 mA·cm~(-2), which is larger almost 20 times than that on the smooth copper electrode.
Keywords
Hydrogen bubble template, Electrodeposition, Porous copper
Publication Date
2006-05-28
Online Available Date
2006-05-28
Revised Date
2006-05-28
Received Date
2006-05-28
Recommended Citation
Ya-feng SUN, Zhen-jiang NIU.
Electrodeposition of Three-dimensional Porous Copper Films Using Hydrogen Bubbles as Template[J]. Journal of Electrochemistry,
2006
,
12(2): 177-182.
DOI: 10.61558/2993-074X.1718
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol12/iss2/10
Included in
Engineering Science and Materials Commons, Materials Chemistry Commons, Materials Science and Engineering Commons, Physical Chemistry Commons