Preface to Special Issue on Electronic Electroplating

Authors

Zhi-Dong Chen, 1. School of petrochemical engineering, Changzhou University, Changzhou 213164, Jiangsu, China;
Chong Wang, 2. School of Materials and Energy, University of Electronic Science and Technology of China;
Wei He, 2. School of Materials and Energy, University of Electronic Science and Technology of China;
Ming Li, 3. School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China;Follow

Corresponding Author

Ming Li(mingli90@sjtu.edu.cn)

DOI Link

https://doi.org/10.13208/j.electrochem.210440

Publication Date

2022-07-28

Online Available Date

2022-07-26

Revised Date

2022-06-25

Received Date

2022-06-02

Recommended Citation

Zhi-Dong Chen, Chong Wang, Wei He, Ming Li. Preface to Special Issue on Electronic Electroplating[J]. Journal of Electrochemistry, 2022 , 28(7): 2104401.
DOI: 10.13208/j.electrochem.210440
Available at: https://jelectrochem.xmu.edu.cn/journal/vol28/iss7/1