Abstract
Based upon the electrochemical characteristics of the components or impurities tobe determined in the electroplating baths,and the inhibition or activation effect of the additives usedon the electrodepcosition processes of metals and alloys,direct voltammetry,indirect voltammetry andvoltammetry with anodic stripping of metallic deposits,were suggested to determine the concentrationof some components,several impurities and the additives usually used in the electroplating baths.Theprocedure of those methtods are simple and rapid,and are suitable to be used for in situ control inelectroplating workshops.
Keywords
Voltammetry, Analysis of plating bath
Publication Date
1995-02-28
Online Available Date
1995-02-28
Revised Date
1995-02-28
Received Date
1995-02-28
Recommended Citation
Jiayuan Xu, Shaomin Zhou.
Application of Voltammetry in Analysis of Electroplating Baths[J]. Journal of Electrochemistry,
1995
,
1(1): 82-86.
DOI: 10.61558/2993-074X.1268
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol1/iss1/13
