Abstract
In the present paper,cyclic voltammetric calorimetry has been used to study thedeposition of copper on platinum electrode from LiClO_4 aqueous solution. Cyclic voltammetricthermogram and cyclic voltammetric differential thermogram show that the deposition of copper on theelectrode is an exothermal process with a strong interaction between copper and platinum layer(-3227.0 kJ /mol).The electrochemical oxidation of the deposited copper is composed of twoprocesses :an endothermal activation process with 747.0 kJ/mol of activation enthalpy,and anexothermal oxidation reaction with-189.9 kJ/mol of the reaction enthalpy, which are accord withthe data from the theoritical estimation and thermodynamic handbook respectively.
Keywords
Cyclic voltammetric calorimetry, Copper, Platinum electrode, Underpotentialdeposition
Publication Date
1995-11-28
Online Available Date
1995-11-28
Revised Date
1995-11-28
Received Date
1995-11-28
Recommended Citation
Yongchun Zhu, Robin H J Clark.
Cyclic Voltammetric Calorimetry Studying the Deposition of Copper of Pt Electrodes[J]. Journal of Electrochemistry,
1995
,
1(4): 427-431.
DOI: 10.61558/2993-074X.1315
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol1/iss4/8
Included in
Engineering Science and Materials Commons, Materials Chemistry Commons, Materials Science and Engineering Commons, Physical Chemistry Commons
