Cyclic Voltammetric Calorimetry Studying the Deposition of Copper of Pt Electrodes

Authors

Yongchun Zhu, Shenyang Medical College, Shenyang 110031
Robin. H. J. Clark, University College London, London, WC1HOAJ

Corresponding Author

Yongchun Zhu

Abstract

In the present paper, cyclic voltammetric calorimetry has been used to study thedeposition of copper on platinum electrode from LiClO₄ aqueous solution. Cyclic voltammetric thermogram and cyclic voltammetric differential thermogram show that the deposition of copper on theelectrode is an exothermal process with a strong interaction between copper and platinum layer (-3227.0 kJ /mol). The electrochemical oxidation of the deposited copper is composed of twoprocesses: an endothermal activation process with 747.0 kJ/mol of activation enthalpy, and an exothermal oxidation reaction with -189.9 kJ/mol of the reaction enthalpy, which are accord with the data from the theoritical estimation and thermodynamic handbook respectively.

Keywords

Cyclic voltammetric calorimetry, Copper, Platinum electrode, Underpotentialdeposition

DOI Link

https://doi.org/10.61558/2993-074X.1315

Publication Date

1995-11-28

Online Available Date

1995-11-28

Revised Date

1995-06-26

Received Date

1994-04-14

Recommended Citation

Yongchun Zhu, Robin. H. J. Clark. Cyclic Voltammetric Calorimetry Studying the Deposition of Copper of Pt Electrodes[J]. Journal of Electrochemistry, 1995 , 1(4): 427-431.
DOI: 10.61558/2993-074X.1315
Available at: https://jelectrochem.xmu.edu.cn/journal/vol1/iss4/8