Abstract
In this study, ethylenediaminetetraacetic acid disodium salt (Na_2EDTA), triethanolamine(TEA), and 2,2′-dipyridine were adopted as chelating agents or additives in the electrolyte for electroless copper plating, and formaldehyde (HCHO) was as the reducting agent. Linear sweep voltammetry was applied to analyze the polarization behavior. The peak current of formaldehyde oxidation which increased by the addition of 2,2′-dipyridine is beneficial to formaldehyde oxidation in a specific range of concentration, While TEA decreased the peak current of formaldehyde oxidation. Two cathodic peaks due to copper(Ⅱ)reduction of TEA chelatation and copper(Ⅱ)reduction of EDTA chelatation were examined. EDTA increased the reduction peak current of Cu-EDTA and decreases that of Cu-TEA, While TEA increased the reduction peak current of Cu-TEA, and it decreased that of Cu-EDTA. The addition of 2,2′-dipyridine also decreases the reduction peak current of Cu-TEA. The experimental results are in agreement with the results obtained by weight gain measurement.
Keywords
Electroless copper plating, Chelating agents, Additives, Polarization, Peak current.
Publication Date
2004-02-28
Online Available Date
2004-02-28
Revised Date
2004-02-28
Received Date
2004-02-28
Recommended Citation
Xin GU, Zhou-Cheng WANG, Chang-Jian LIN.
An Electrochemical Study of the Effects of Chelating Agents and Additives on Electroless Copper Plating[J]. Journal of Electrochemistry,
2004
,
10(1): 14-19.
DOI: 10.61558/2993-074X.1539
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol10/iss1/3
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