Abstract
Silicon chips patterned with treneches were fixed onto a rotating electrode. Copper was electrodeposited into the trenches under rotating hydrodynamic conditions The sizes of the trenches are 1 m in height and 0.35 m, 0.50 m and 0.70 m in width, respectively. The effects of rotating of the chip, the current density and the concentration of Cu~(2+ )on the filling of thetrenches were studied. It is found that lower current density and moderate concentration of Cu~(2+)resulted in a void free filling of the trenches.
Keywords
Electrodeposition, Copper, Rotating electrode, Trench, Chip, Super-conformal plating
Publication Date
2004-05-28
Online Available Date
2004-05-28
Revised Date
2004-05-28
Received Date
2004-05-28
Recommended Citation
Jian-jun SUN.
Electrodeposition of Copper into Trenches Under Rotating Hydrodynamic Condition[J]. Journal of Electrochemistry,
2004
,
10(2): 210-214.
DOI: 10.61558/2993-074X.1567
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol10/iss2/13
Included in
Engineering Science and Materials Commons, Materials Chemistry Commons, Materials Science and Engineering Commons, Physical Chemistry Commons
