Electrodeposition of Copper into Trenches Under Rotating Hydrodynamic Condition

Authors

Jian-jun SUN, ,XIE Bu-gao, YIN Wen-hui, CHEN Guo-nan (epartment of Chemistry, Fuzhou University, Fuzhou 350002, China;

Abstract

Silicon chips patterned with treneches were fixed onto a rotating electrode. Copper was electrodeposited into the trenches under rotating hydrodynamic conditions The sizes of the trenches are 1 m in height and 0.35 m, 0.50 m and 0.70 m in width, respectively. The effects of rotating of the chip, the current density and the concentration of Cu~(2+ )on the filling of thetrenches were studied. It is found that lower current density and moderate concentration of Cu~(2+)resulted in a void free filling of the trenches.

Keywords

Electrodeposition, Copper, Rotating electrode, Trench, Chip, Super-conformal plating

DOI Link

https://doi.org/10.61558/2993-074X.1567

Publication Date

2004-05-28

Online Available Date

2004-05-28

Revised Date

2004-05-28

Received Date

2004-05-28

Recommended Citation

Jian-jun SUN. Electrodeposition of Copper into Trenches Under Rotating Hydrodynamic Condition[J]. Journal of Electrochemistry, 2004 , 10(2): 210-214.
DOI: 10.61558/2993-074X.1567
Available at: https://jelectrochem.xmu.edu.cn/journal/vol10/iss2/13

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