Selective Electroless Copper Plating Micro-pattern on Ceramics Without Sensitisation and Activation

Authors

Zhen-lin XU, 1, 2), GUO Qi-long~(1), SHEN Yi-cheng~(1, 2), ZHAO Xiong-chao~(1), HONG Yan-ping~(1), GU Zhi-jun~(*1)(1.Institute of Matter Structure Chinese Academy of Sciences, Corrosion Division, Xiamen 361012,China, 2.Graduate School of the Chinese Academy of Sciences,Beijing 100039,China.;

Abstract

The purpose of this article is to provide a new technology of electroless copper plating without palladium activation steps. By combining the technology of laser micro-etching with the new copper-plating bath, copper plating on ceramics was obtained. The experimental results showed that the solution used for copper electroless plating was stable and the copper coating obtained was bright,dense with good electrical conductivity.The line definition was about 40 μm. The electroless Cu films deposited from this system were gentle and required simple operating conditions.

Keywords

Ceramic, Electrolesscopperplating, Activation, Complexant, Metallization, Interconnection

DOI Link

https://doi.org/10.61558/2993-074X.1639

Publication Date

2005-05-28

Online Available Date

2005-05-28

Revised Date

2005-05-28

Received Date

2005-05-28

Recommended Citation

Zhen-lin XU. Selective Electroless Copper Plating Micro-pattern on Ceramics Without Sensitisation and Activation[J]. Journal of Electrochemistry, 2005 , 11(2): 193-198.
DOI: 10.61558/2993-074X.1639
Available at: https://jelectrochem.xmu.edu.cn/journal/vol11/iss2/15