Using Electrodeposition to Fabricate Mould for Polymer Microfluidic Chip

Authors

LUO Yi, ,CHU De-nan,LOU Zhi-feng,LIU Chong,WANG Li-ding(Key Lab for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology,Dalian 116032,China;

Abstract

Many researches have been focused on polymer microfluidic chip in recent years and the mould plays an important role in its fabrication process. Using electrodepositingmethod to fabricate a metal mould for polymer microfluidic chip has been presented in this paper. An ultra-thick photoresist SU-8 was coated on a pretreated metal plate, after photolithography, nickel was electrodeposited in the patterned SU-8, then was removed the SU-8 to obtain a final metal mould. This methodreduces workload of electrodeposit largely. Applying counter current before deposit, adding additive to solution and vacuum anneal after demould have been used to improve the binding force between Ni substrate and electrodeposit structure.

Keywords

Electrodeposit, Photolithograph, Binding force

DOI Link

https://doi.org/10.61558/2993-074X.1641

Publication Date

2005-05-28

Online Available Date

2005-05-28

Revised Date

2005-05-28

Received Date

2005-05-28

Recommended Citation

LUO Yi. Using Electrodeposition to Fabricate Mould for Polymer Microfluidic Chip[J]. Journal of Electrochemistry, 2005 , 11(2): 204-207.
DOI: 10.61558/2993-074X.1641
Available at: https://jelectrochem.xmu.edu.cn/journal/vol11/iss2/17

References

[1]HarrisonDJ,FluriK.,SeilerK.,etal.Micromachin ingaminiaturizedcapillaryelectrophoresis basedchemi calanalysissystemonachip[J].Science,1993,261:895～897.
[2]FangZhaolun(方肇伦).MicorfluidicChip[M].Bei jing:SciencePress,2003.
[3]Microchem.NanoSU82000NegativeTonePhotoresists Formulations[Z].25～75.