The Growth of Aluminide-layer during the Hot-dipping Al-(Si ) Coating onto 430 Stainless Steels

Authors

Peng-chicao CHEN, 1), WANG Chaur-jeng*~(1), LIN Yu-chang~(1), CHING Hsuan~(2)(1.Department of Mechanical Engineering,Taiwan University of Science and Technology,Taibei,China,2.Department of Mechanical Engineering, Tung Nan Institute of Technology, Taibei,China;

Abstract

The 430 stainless steels have been hot dipped in the molten Al-6.5%Si melts from 680 to 800℃, respectively. The effects of the hot dipping temperature and time on the thickness of the internal alloy layer have been investigated. The activation energy of the growth kinetic of aluminized layer was also calculated. The results showed that the thickness of aluminized layer increased with increasing dipping time and temperature. Besides, the growth kinetic of aluminized layer obeys parabolic rate law. The FeAl_(3 )and Fe_(2)Al_(5 )were formed by the inward diffusion, and the interface of intermetallic layer will be rugged and rough at the 800℃ more than 680℃.

Keywords

Hot-dip aluminum-silicon, Hot-dip pure aluminum, 430 stainless steel, Aluminide layer.

DOI Link

https://doi.org/10.61558/2993-074X.1652

Publication Date

2005-08-28

Online Available Date

2005-08-28

Revised Date

2005-08-28

Received Date

2005-08-28

Recommended Citation

Peng-chicao CHEN. The Growth of Aluminide-layer during the Hot-dipping Al-(Si ) Coating onto 430 Stainless Steels[J]. Journal of Electrochemistry, 2005 , 11(3): 271-276.
DOI: 10.61558/2993-074X.1652
Available at: https://jelectrochem.xmu.edu.cn/journal/vol11/iss3/6