The Mechanism of Ethylenediamine on Electroless Ni-B Alloy Deposition

Authors

Sen-lin WANG, College of Materials Science and Engineering,Huaqiao University,Quanzhou 362021,China;

Abstract

The effects of ethylenediamine stabilizer on the deposition rate and on the stability of the plating bath for electroless deposition of Ni-B alloy were investigated.It was found that the addition of ethylenediamine greatly enhances the stability of the electroless plating bath.The electrochemical polarization including cathodic and anodic polarizations measurements were carried out to examine the effect of ethylenediamine on the deposition process.The results show that ethylenediamine affects both the cathodic and the anodic polarization processes.The oxidation current of the reducer and the reduction current of Ni-B alloy decrease greatly when ethylenediamine was added into the plating bath.The infrared spectroscopy(IR) experiments were carried out to investigate the mechanism of ethylenediamine on the deposition process.It was found that ethylenediamine restrains the oxidation of the reducer owing to its chemically adsorbing on the nickel substrate,which greatly decreases the deposition rate.

Keywords

Electroless deposition, Ni-B alloy, Ethylenediamine, Electrochemical polarization, IR spectrum

DOI Link

https://doi.org/10.61558/2993-074X.1682

Publication Date

2005-11-28

Online Available Date

2005-11-28

Revised Date

2005-11-28

Received Date

2005-11-28

Recommended Citation

Sen-lin WANG. The Mechanism of Ethylenediamine on Electroless Ni-B Alloy Deposition[J]. Journal of Electrochemistry, 2005 , 11(4): 430-434.
DOI: 10.61558/2993-074X.1682
Available at: https://jelectrochem.xmu.edu.cn/journal/vol11/iss4/15

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