The High Temperature Corrosion of 2205 Duplex Stainless Steel with NaCl Deposit

Authors

Fu-fu PENG, Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taipei, Taiwen, China
Chaur-jeng WANG, Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taipei, Taiwen, ChinaFollow
Yu-chang LIN, Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taipei, Taiwen, China

Corresponding Author

Chaur-jeng WANG(cjwang@mail.ntust.edu.tv)

Abstract

The objective of this study was to figure out the hot corrosion behavior of 2205 duplex stainless steel (2205 DSS) within the temperature ranges from 550 to 850℃ in the static air condition with 2 mg/cm² NaCl deposit, and in the air atmosphere condition with a constant flow rate of 500 vppm NaCl_(g), respectively. Experimental results show that the hot corrosion kinetics met the parabolic rate law and the corrosion rate increased constantly with increasing temperature. The scales formed included Fe₂O₃/Fe₃O₄/Cr₂O₃ and FeCr₂O₄ from outer layer to inner layer. The sequence of formation is independent of the environment temperature,but the SiO₂ and NiO can be found in the substrate of 850℃ specimen. The corrosion sequence in two phase structure of 2205 DSS was not influenced by α and γ phases in the 2 mg/cm² NaCl deposit due to complete corrsion and in the air atmospheres condition with a constant flow rate of 500 vppm NaCl_(g). In the case of constant flow rate of 500 vppm NaCl_(g), the corrosion rate in the γ phase was greater than that in the α phase,although the corrosion sequence was not known.

Keywords

Duplex stainless steel, 2205DSS, High-temperature corrosion

DOI Link

https://doi.org/10.61558/2993-074X.1670

Publication Date

2005-11-28

Online Available Date

2005-11-28

Revised Date

2005-11-20

Received Date

2005-03-18

Recommended Citation

Fu-fu PENG, Chaur-jeng WANG, Yu-chang LIN. The High Temperature Corrosion of 2205 Duplex Stainless Steel with NaCl Deposit[J]. Journal of Electrochemistry, 2005 , 11(4): 369-376.
DOI: 10.61558/2993-074X.1670
Available at: https://jelectrochem.xmu.edu.cn/journal/vol11/iss4/3