An Electrochemical Study of Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent

Authors

Li-Qiong WU, ,HANG Ling,SUN Shi-Gang,ZHOU Shao-Min(College of Chemistry and Chemical Engineering,State Key Laboratory ofPhysical Chemistry of the Solid Surfaces,Xiamen University,Xiamen 361005,China;
Fang-Zu YANG, ,HANG Ling,SUN Shi-Gang,ZHOU Shao-Min(College of Chemistry and Chemical Engineering,State Key Laboratory ofPhysical Chemistry of the Solid Surfaces,Xiamen University,Xiamen 361005,China;

Abstract

The electroless copper plating using glyoxylic acid as a reducing agent,Na_(2)EDTA as a chelating agent and K_(4)Fe(CN)_(6) and 2,2'-dipyridyl as additives was studied.The effect of chelating agent and addtives on the polangation behaviovs of copper reduction and glyoxylie acid oxidation were analyzed by linear sweep voltammetry.The results mainly demonstrated that the chelating agent hindered both the oxidation of glyoxylic acid and the reduction of copper complexing ions.It has revealed that K_(4)Fe(CN)_(6)and 2,2'-dipyridyl(with the content over than 20 mg/L)both played negative actions on the oxidation of glyoxylic acid.

Keywords

Electroless copper plating, glyoxylic acid, Chelating agent, Additives, Polarization

DOI Link

https://doi.org/10.61558/2993-074X.1676

Publication Date

2005-11-28

Online Available Date

2005-11-28

Revised Date

2005-11-28

Received Date

2005-11-28

Recommended Citation

Li-Qiong WU, Fang-Zu YANG. An Electrochemical Study of Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent[J]. Journal of Electrochemistry, 2005 , 11(4): 402-406.
DOI: 10.61558/2993-074X.1676
Available at: https://jelectrochem.xmu.edu.cn/journal/vol11/iss4/9