Abstract
In this work,the gold-plated mica was used for the substrate,the concentration of 5% of normal plating solution for the nickel was used as the mother solution,and the effect for the deposition by the brighter with ECSTM was in-situ detected.The solution for deposition without the brighter has no brightness,though the values of the roughness and the H_(A-V) have reduced in evidence after deposition;the solution for deposition with the complete brighter although has great brightness,the values of the roughness and the H_(A-V) have increased(after) deposition;the solution for deposition with the half brighter has a moderate effect on the H_(A-V) and (brightness).Hence,the brighter effect is not the micro-leveling effect,and the micro-leveling effect has no direct relation with the brightness.
Keywords
ECSTM, Brighter, In-situ, Micro-leveling effect, Roughness
Publication Date
2006-02-28
Online Available Date
2006-02-28
Revised Date
2006-02-28
Received Date
2006-02-28
Recommended Citation
Jian ZHENG, Ning LI, De-yu LI, Guo-feng CUI.
In-situ Detection of the Effect of Brighter in the Solution for Nickel and Phosphor Alloy[J]. Journal of Electrochemistry,
2006
,
12(1): 98-103.
DOI: 10.61558/2993-074X.1707
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol12/iss1/20
References
[1]X ie ZhaoX iong(谢兆雄),M ao B ingW e i(毛秉伟),Zhuo X iangDong(卓向东),et al.In situ stud ies ofcopper electrodepostion on HOPG by using ECSTM[J].E lectrochem istry,1996,2:164.
[2]W an L ijun(万立骏),W ang Chen(王梁),Bai Chun li(白春礼).An introduction to electrochem ical scann ingprobe m icroscopy[J].Technology lead ing edge&Sc i-ence Comm ent(科技前沿与学术评论),2002,(6):50~53.
[3]Zhang Qun.Scann ing tunneling m icroscop[J].Know l-edge Lectures,2002,29:47~49.
[4]Hu YanL ing,Hu RongGang,ShaoM inHua,et al.In-si-tu ECSTM investigation on passivation surface for poly-crystalline stain less steel[J].Journal of Ch inese E lec-tron M icroscopy Soc iety,2001,5:631~635.
[5]An M Z(安茂忠).An E lectrop lating Theories andTechnologies[M].Haerb in:Haerb in Institute of Tech-nology Press.2004.
[6]Cai X iongW e i(蔡雄伟),X ie ZhaoX iong(谢兆雄),Zhuo X iangDong(卓向东),et al.Scann ing TunnelingM icroscop ic Stud ies of Rough Au Surfaces w ith Atom icResolution[J].E lectrochem istry,1997,3:21~25.
[7]Darrort V,Troyon M,Ebothe J,et al.Quantitativestudy by atom ic force m icroscopy and spectrophotom etryof the roughness and brightness of electrodepositedn ickel in the presence of add itives[J].The SolidF ilm s,1995,(165):557.
[8]Jens A D Jensen,Per O A Persson,Karen Pantleon,etal.E lectrochem ically deposited n ickel m embranes:process m icrostructure property relationsh ips[J].Sur-face and Coating Technology,2003,(172):79~89.
[9]L iu P ing(刘平),Yao Pe i(姚?).Study on the prepa-ration of tip for scann ing tunneling m icroscopy[J].Mo-dem istic Instrum ents,2003,(6):30~32.
[10]Yu Chang(余昶),W ang Hu i(王晖).A chem icalm ethod for removing the oxide layer of STM tungstentips[J].Vacuum E lectron ic,2004,(2):31~33.
[11]Yao Pe i(姚?),L i ChunYan(李春艳),L iu P ing(刘平),et al.Preparation of STM tips and the improve-m ent on its electrochem ical device[J].Journal of Ch i-nese E lectronM icroscopy Soc iety,2003,22:256~258.
[12]X ie ZhaoX iong(谢兆雄),M ao B ingW e i(毛秉伟),Yang FangZu(杨防祖).In S itu Stud ies ofH ighly O ri-ented Zn-N i A lloy E lectrop lating by Using ECSTM.Chem ical Journal of Ch inese Un iversities,1998,19:609~612.
[13]Jianwe i L iu,X iangYang Chen,M ingW ang Shao.In itialstages of N i P electrodeposition growth morphology andcomposition of deposits[J].Journal of Crystal G rowth.2003,(252):297~301.
Included in
Analytical Chemistry Commons, Engineering Science and Materials Commons, Materials Chemistry Commons, Materials Science and Engineering Commons, Physical Chemistry Commons
