Effect of 2,2€²-dipyridyl and K_4Fe(CN)_6 on Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent

Authors

Dan-dan SHEN, Chemistry Department,State Key Laboratory of Physical Chemistry of the Solid Surfaces,College of Chemistry and Chemical Engineering,Xiamen University,Xiamen 361005,Fujian,China;
Fang-zu YANG, Chemistry Department,State Key Laboratory of Physical Chemistry of the Solid Surfaces,College of Chemistry and Chemical Engineering,Xiamen University,Xiamen 361005,Fujian,China;
Hui-huang WU, Chemistry Department,State Key Laboratory of Physical Chemistry of the Solid Surfaces,College of Chemistry and Chemical Engineering,Xiamen University,Xiamen 361005,Fujian,China;

Corresponding Author

Hui-huang WU

Abstract

The electroless copper plating was studied in a bath consisting of glyoxylic acid as reducing agent,Na2EDTA as complexing agent,both 2,2'-dipyridyl and K4Fe(CN)6 as additives,focused on the influence of the additives on the deposition rate,as well as on the composition,structures and surface morphology of the deposits.It was found that adding an optimum amount of 2,2'-dipyridyl and K4Fe(CN)6 to the bath will not only improve the stability of the bath,but also increase the deposition rate by 100 %.The simultaneous addition of both additives causes the deposits to bright appearance and the change in morphology.The deposits were proved to be polycrystalline copper,in which no Cu2O was detected.

Keywords

electroless copper plating, glyoxylic acid, additives, deposition rate, surface morphology

DOI Link

https://doi.org/10.61558/2993-074X.1782

Publication Date

2007-02-28

Online Available Date

2007-02-28

Revised Date

2007-02-28

Received Date

2007-02-28

Recommended Citation

Dan-dan SHEN, Fang-zu YANG, Hui-huang WU. Effect of 2,2€²-dipyridyl and K_4Fe(CN)_6 on Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent[J]. Journal of Electrochemistry, 2007 , 13(1): 67-71.
DOI: 10.61558/2993-074X.1782
Available at: https://jelectrochem.xmu.edu.cn/journal/vol13/iss1/11