Research of 2,2′-dipyridine on Electroless Copper Plating Using Sodium Hypophosphite as Reductant

Authors

• Bin YANG, State Key Laboratory of Physical Chemistry of the Solid Surfaces, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian, China;
• Fang-zu YANG, State Key Laboratory of Physical Chemistry of the Solid Surfaces, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian, China;Follow
• Ling HUANG, State Key Laboratory of Physical Chemistry of the Solid Surfaces, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian, China;
• Shu-kai XU, State Key Laboratory of Physical Chemistry of the Solid Surfaces, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian, China;
• Guang-hua YAO, State Key Laboratory of Physical Chemistry of the Solid Surfaces, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian, China;
• Shao-min ZHOU, State Key Laboratory of Physical Chemistry of the Solid Surfaces, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian, China;

Corresponding Author

Fang-zu YANG(fzyang@xmu.edu.cn)

Abstract

In the bath of the electroless copper plating using sodium hypophosphite as reductant, the effects of 2,2′-dipyridine on the deposition rate, anodic oxidation of sodium hypophosphite, cathodic reduction of copper ions, surface morphologies, structure and the existing status of the deposit components were examined. The results showed that, 2,2′-dipyridine hindered the electroless deposition.Experiments of liner sweep voltammetry (LSV) indicated that,as the addition of 2,2′-dipyridine to the electrolyte, the oxidation peak potential of sodium hypophosphite shifted to a more negative value but the peak current decreased; the reducing peak potential of copper ions moved to a more negative value whereas the peak current increased. Scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and X-ray photoelectron spectroscopic (XPS) experiments displayed that, the additive caused the deposit in the compacter,brighter and lower nickel content. The deposit was Cu-Ni alloy in face-centered cubic structure without obvious crystal face preferred orientation. The copper and nickel in the deposit were in metal state, and the weight content of phosphorus was less than 0.05%.

Keywords

electroless copper plating, sodium hypophosphite, 2, 2′-dipyridine

DOI Link

https://doi.org/10.61558/2993-074X.1847

Publication Date

2007-11-28

Online Available Date

2007-11-28

Revised Date

2007-08-10

Received Date

2007-07-24

Recommended Citation

Bin YANG, Fang-zu YANG, Ling HUANG, Shu-kai XU, Guang-hua YAO, Shao-min ZHOU. Research of 2,2′-dipyridine on Electroless Copper Plating Using Sodium Hypophosphite as Reductant[J]. Journal of Electrochemistry, 2007, 13(4): 425-430.
DOI: 10.61558/2993-074X.1847
Available at: https://jelectrochem.xmu.edu.cn/journal/vol13/iss4/14