Prepartion and Characterization of SPR Au Substrate Using Wet Chemical Plating

Authors

You-chen ZHOU, Department of Chemistry,College of Chemistry and Chemical Engineering,State Key Lab for Physical Chemistry of Solid Surface,Xiamen University,Xiamen 361005,Fujian,China;
Yan-yan WANG, Department of Chemistry,College of Chemistry and Chemical Engineering,State Key Lab for Physical Chemistry of Solid Surface,Xiamen University,Xiamen 361005,Fujian,China;
Zhi-fang MA, Department of Chemistry,College of Chemistry and Chemical Engineering,State Key Lab for Physical Chemistry of Solid Surface,Xiamen University,Xiamen 361005,Fujian,China;
Yan-xia JIANG, Department of Chemistry,College of Chemistry and Chemical Engineering,State Key Lab for Physical Chemistry of Solid Surface,Xiamen University,Xiamen 361005,Fujian,China;
Jin QIU, Department of Chemistry,College of Chemistry and Chemical Engineering,State Key Lab for Physical Chemistry of Solid Surface,Xiamen University,Xiamen 361005,Fujian,China;
Shi-gang SUN, Department of Chemistry,College of Chemistry and Chemical Engineering,State Key Lab for Physical Chemistry of Solid Surface,Xiamen University,Xiamen 361005,Fujian,China;

Abstract

The present study developed a preparation method of SPR gold substrate based on water phase operation.Firstly,on the glass modified by APTMS we self-assembed a gold colloid monolayer as the catalyst bed;Secondly,using the chemical plating technique,we made the gold film increase equably within the namometer range to obtain the proper shape and thinkness of the gold film required by the SPR.The analysis results of UV-vis and TEM demonstrated that the diameter of the monolayer formed from gold nanoparticles was 2.5 nm.Moreover,SEM showed that the nanoparticle prepared by electroless gold plating was uniformly distributed,whose diameter was 40 nm.The SPR flow injection experiment found that the response intensity of the SPR Au substrate made by wet chemical plating was as strong as that of the commercial SPR Au substrate made by vacuum sputtering,and the former one was more preferable to adjust the surface structure of the gold film than the later one.

Keywords

surface plasmon resonance(SPR), wet chemical plating, homemade SPR Au substrate, commercial SPR Au substrate

DOI Link

https://doi.org/10.61558/2993-074X.2076

Publication Date

2011-02-28

Online Available Date

2011-02-28

Revised Date

2011-02-28

Received Date

2011-02-28

Recommended Citation

You-chen ZHOU, Yan-yan WANG, Zhi-fang MA, Yan-xia JIANG, Jin QIU, Shi-gang SUN. Prepartion and Characterization of SPR Au Substrate Using Wet Chemical Plating[J]. Journal of Electrochemistry, 2011 , 17(1): 31-36.
DOI: 10.61558/2993-074X.2076
Available at: https://jelectrochem.xmu.edu.cn/journal/vol17/iss1/4

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