Electrochemical Studies on Chemical Polishing of Copper

Authors

Keping Han, Department of Chemistry,Shanghai University,Jiading Campus,Shanghai,201800;
Jingli Fang, Chem. Depart.,Appl.Chem.Inst.,Nanjing University,Nanjing 210093;

Abstract

Changes in specular reflectivity,weight loss,surface topograph and potential with time and current-potential curves during chemical polishing were determined.The results showed that chemical polishing was composed of the etching,polishing and pitting stage.The passivating film theory also applied to the chemical polishing.

Keywords

Copper, chemical polishing, Reflectivity, surface topograph

DOI Link

https://doi.org/10.61558/2993-074X.1341

Publication Date

1996-08-28

Online Available Date

1996-08-28

Revised Date

1996-08-28

Received Date

1996-08-28

Recommended Citation

Keping Han, Jingli Fang. Electrochemical Studies on Chemical Polishing of Copper[J]. Journal of Electrochemistry, 1996 , 2(3): 310-313.
DOI: 10.61558/2993-074X.1341
Available at: https://jelectrochem.xmu.edu.cn/journal/vol2/iss3/12

References

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