Kinetics and Mechanism of Acidic Electroless Ni-P Plating

Authors

Zhi-hui XIE, Chemical Synthesis and Pollution Control Key Laboratory of Sichuan Province, College of Chemistry and Chemical Engineering , China West Normal University, Nanchong 637002, Sichuan, China;Follow
Gang YU, State Key Laboratory of Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha 410082, ChinaFollow

Corresponding Author

Zhi-hui XIE(zhihuixie@yeah.net);Gang YU(yuganghnu@163.com)

Abstract

Electrochemical behaviors of electroless nickel (EN) plating in three systems, namely, cathodic, anodic and complete bath solutions were investigated by polarization methods. The curves in the complete baths were not entirely consistent with those expected from a combination of the anodic and cathodic polarization curves, which implies that the anodic and cathodic reactions of the EN plating are interdependent. The effects of concentration of nickel ions, hypophosphite and pH on the polarization parameter and deposition rate in a complete bath were also discussed and compared by performing electrochemical and gravimetrical measurements. Based on these variations in the deposition potential and current density, a kinetic expression employing the Butler-Volmer equation is suggested and verified with the experimental findings. It was confirmed that the electroless nickel deposition processes in the present system was under a mixed control. The apparent activation energy determined by electrochemical methods was about 42.89 kJ·mol^-1.

Graphical Abstract

Keywords

electroless plating, polarization, electrochemical mechanism, mixed potential theory, deposition rate

DOI Link

https://doi.org/10.13208/j.electrochem.140321

Publication Date

2014-12-28

Online Available Date

2014-04-10

Revised Date

2014-03-21

Received Date

2014-03-21

Recommended Citation

Zhi-hui XIE, Gang YU. Kinetics and Mechanism of Acidic Electroless Ni-P Plating[J]. Journal of Electrochemistry, 2014 , 20(6): 140321.
DOI: 10.13208/j.electrochem.140321
Available at: https://jelectrochem.xmu.edu.cn/journal/vol20/iss6/13