Abstract
The nickel ions (Ni2+) were introduced into choline chloride (ChCl) cyanide free immersion gold solution to improve the surface quality of electrodeposition on medium-phosphorus nickel substrate. The addition of Ni2+ had no significant impact on the plating speed. However, the hyperactive corrosion of nickel substrate could be effectively alleviated by the addition of 500 mg·L-1 NiCl2·6H2O, and the surface morphology of gold coating could be greatly improved. The choline chloride bath has great potential for industrial production due to its high Ni2+ carrying capacity (2000 mg·L-1) and superior applicability to medium-phosphorus nickel substrate.
Graphical Abstract
Keywords
non-cyanide, immersion gold, choline chloride, hyperactive corrosion, Ni2+
Publication Date
2018-02-28
Online Available Date
2017-10-20
Revised Date
2017-10-19
Received Date
2017-04-17
Recommended Citation
Tian-yu XU, Shi-ying WANG, Wen-chang WANG, Zhi-dong CHEN.
Surface Ehancement of Nickel Ions on Cyanide Free Immersion Gold Deposited from a Chloroauric Acid-Choline Chloride Solution on Medium-Phosphorus Nickel[J]. Journal of Electrochemistry,
2018
,
24(1): 170445.
DOI: 10.13208/j.electrochem.170445
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol24/iss1/13
References
[1] Sharma R K, Kaneriya R, Patel S, et al. Microwave integrated circuits fabrication on alumina substrate using pattern up direct electroless nickel and immersion Au plating and study of its properties[J]. Microelectronic Engineering, 2013, 108: 45-49.
[2] Kim J, Myung W R, Jung S B. Effects of aging treatment on mechanical properties of Sn-58Bi epoxy solder on ENEPIG-surface-finished PCB[J]. Journal of Electronic Materials, 2016, 45(11): 5895-5903.
[3] Estrine E C, Riemer S, Venkatasamy V, et al. Mechanism and stability study of gold electrodeposition from thiosulfate-sulfite solution[J]. Journal of The Electrochemical Society, 2014, 161(12): D687-D696.
[4] Green T A, Roy S. Speciation analysis of Au(I) electroplating baths containing sulfite and thiosulfate[J]. Journal of The Electrochemical Society, 2006, 153(3): C157-C163.
[5] Li B, Li N, Luo G, et al. Acceleration effect of Na2S2O3 on the immersion gold plating on Ni-P surface from a sulfite based electrolyte[J]. Surface and Coatings Technology, 2016, 302: 202-207.
[6] Wang Y, Cao X, Wang W, et al. Immersion gold deposition from a chloroauric acid-choline chloride solution: Deposition kinetics and coating performances[J]. Surface and Coatings Technology, 2015, 265: 62-67.
[7] Ballantyne A D, Forrest G C H, Frisch G, et al. Electrochemistry and speciation of Au+ in a deep eutectic solvent: Growth and morphology of galvanic immersion coatings[J]. Physical Chemistry Chemical Physics, 2015, 17(45): 30540-30550.
[8] Zeng K, Stierman R, Abbott D, et al. The root cause of Black Pad failure of solder joints with electroless Ni/immersion gold plating[J]. Journal of Metals, 2006, 58(6): 75-79.
[9] Liu H P, Li N, Bi S F. Effect of polyethylene imine on corrosion of electroless nickel substrates during immersion gold plating[J]. Rare Metal Materials and Engineering, 2009, 38(6): 1087-1090.
[10] Won Y S, Park S S, Lee J, et al. The pH effect on black spots in surface finish: Electroless nickel immersion gold[J]. Applied Surface Science, 2010, 257(1): 56-61.
[11] Protsenko V S, Kityk A A, Shaiderov D A, et al. Effect of water content on physicochemical properties and electrochemical behavior of ionic liquids containing choline chloride, ethylene glycol and hydrated nickel chloride[J]. Journal of Molecular Liquids, 2015, 212: 716-722.
[12] Abbott A P, El Ttaib K, Ryder K S, et al. Electrodeposition of nickel using eutectic based ionic liquids[J]. Transactions of the IMF, 2008, 86(4): 234-240.
[13] Wang Y, Liu H, Bi S, et al. Effects of organic additives on the immersion gold depositing from a sulfite-thiosulfate solution in an electroless nickel immersion gold process[J]. RSC Advances, 2016, 6(12): 9656-9662.
Included in
Materials Chemistry Commons, Nanoscience and Nanotechnology Commons, Physical Chemistry Commons
