Corresponding Author

Fang-zu YANG(fzyang@xmu.edu.cn);
Dong-ping ZHAN(dpzhan@xmu.edu.cn)


In this paper, the copper interconnection technology in chip manufacturing is introduced in detail, and the essentials of acidic copper sulfate electroplating process and the mechanisms of common-used additives are reviewed. The progresses of novel additives at home and abroad are also summarized. Based on the studied achievement, the possibility of the novel copper interconnect process replacing the acidic copper electroplating is prospected.

Graphical Abstract


chips, copper interconnection, acidic copper sulfate electroplating, additives

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