Abstract
As a typical surface texture, microgrooves have broad prospects in the fields of mechanical engineering, bio-medicine, new energy and efficient heat dissipation of electronic products. Through-mask electrochemical micromachining (TMEMM) is widely used in the fabrication of micro-structures because of high processing efficiency and no residual stress. However, due to the edge effect of current distribution, there is often a serious dimension discrepancy problem in electrochemical machining of micro-structures. In order to weaken the influence of edge effect on the uniformity of microgrooves, the method that TMEMM with a moving cathode is presented. The current distribution in the electrochemical machining is constantly changed by the movement of the cathode. Thus, the uniformity of the micro-structure is improved. The method is studied through the combination of simulation and experimental verification. Firstly, the electrochemical machining process of TMEMM was analyzed theoretically. The theoretical analysis results show that the depth of electrolytic etching is proportional to the current density of electrolytic machining. To change the uniformity of the electrochemical machining, the most important thing is to improve the uniformity of the current distribution. On this theoretical basis, the current distribution and anodic contour of microgroove array during TMEMM are simulated by using the COMSOL finite element analysis software. The simulation results indicate that, compared with the conventional TMEMM, the TMEMM with moving cathode can obtain the microgrooves array with more uniform size. Secondly, on the basis of numerical simulation, the TMEMM experiment was carried out. The experimental results indicate that the TMEMM method of moving cathode can effectively improve the size uniformity of microgroove array. It can be observed by microscope that the microgroove array obtained by TMEMM with a moving cathode had good structural morphology and higher uniformity. Compared with conventional TMEMM, the uniformity of TMEMM with moving cathode has been improved by 68.3%. At the same time, under different experimental conditions, the trend of unevenness of microgroove array was calculated. With the increase of the distance between the cathode and anode, the microgroove depth heterogeneity showed a tendency of first decreasing and then increasing, when the distance between anode and cathode is about 1.3 mm, the unevenness of microgroove array reaches the minimum point. With the increases of cathode width and cathode speed, the depth inhomogeneities of microgroove increase and decrease gradually, respectively. The simulation results are basically consistent with the experimental results. It can be seen that the TMEMM with the moving cathode method can greatly improve the size uniformity.
Graphical Abstract
Keywords
moving cathode, microgroove structure, through-mask electrochemical micromachining, etching uniformity
Publication Date
2021-12-28
Online Available Date
2021-02-18
Revised Date
2021-02-15
Received Date
2020-12-24
Recommended Citation
Li-Qun Du, Yi-Kui Wen, Fa-Long Guan, Ke Zhai, Zuo-Yan Ye, Chao Wang.
Study on the Uniformity of Microgrooves in Through-Mask Electrochemical Micromachining with Moving Cathode[J]. Journal of Electrochemistry,
2021
,
27(6): 658-670.
DOI: 10.13208/j.electrochem.201224
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol27/iss6/7
References
[1]
Wang H X, Zhuang J, Yu J T, Qi H Y, Ma Y H, Wang H B, Guo Z J. Fabrication of anti-reflective surface with superhydrophobicity/high oleophobicity and enhanced mechanical durability via nanosecond laser surface texturing[J]. Materials, 2020, 13(24): 5691.
doi: 10.3390/ma13245691
URL
[2]
Rosenkranz Andreas, Costa Henara L, Baykara Mehmet Z, Martini A. Synergetic effects of surface texturing and solid lubricants to tailor friction and wear - A review[J]. Tribol. Int., 2021, 155: 106792.
doi: 10.1016/j.triboint.2020.106792
URL
[3]
Guthrey H, Salles C L, Kale A S, Nemeth W, Page M, Agarwal S, Young D L, Al-Jassim M, Stradins P. Effect of surface texture on pinhole formation in SiOx-based passivated contacts for high-performance silicon solar cells[J]. ACS Appl. Mater. Interfaces, 2020, 12(50): 55737-55745.
doi: 10.1021/acsami.0c12795
URL
[4] Gao Y H(高一航). Design and application of bionic flow channel based on hexagonal structure[D]. Jilin University(吉林大学), 2019.
[5] Yuan S H(袁思欢). Research on friction properties of micro-grooves surface textures[D]. Nanjing University of Aeronautics and Astronautics(南京航空航天大学), 2011.
[6] Hu Q H(胡清辉). Numerical simulation and design of metallic bipolar plate flow field parameters for proton exchange membrane fuel cell[D]. Wuhan University of Tech-nology(武汉理工大学), 2016.
[7] Su B(苏彬). The preparation of macroscopically oriented mesoporous films and their primary application in solar cells[D]. Shanghai Jiao Tong University(上海交通大学), 2009.
[8] Zhang Y(张洋). Study on the milling performance of textured ball-end milling cutter with coating[D]. Jiangsu University(江苏大学), 2020.
[9] Qi B Y(戚宝运). Research on cooling/lubrication technology of green cutting of titanium alloy using surface micro-textured cutting tool[D]. Nanjing University of Aero-nautics and Astronautics(南京航空航天大学), 2011.
[10] Liu Y(刘煜). Study on carbide cutting tool's surface micro-texture processed by nanosecond laser and its correlative mechanisms[D]. Jilin University(吉林大学), 2021.
[11] Zhang T(张涛). Research on surface texturing of polyimide composites by micro-ultrasonic machining[D]. Nanjing University of Aeronautics and Astronautics(南京航空航天大学), 2017.
[12] Yui A, Yan J W, Aoyama H. Ultraprecision micro grooving on brass for surface wettability control[J]. Adv. Mater.Res., 2014, 1017: 489-494.
[13]
Tamura T, Akiyama R, Tanaka R, Kawamoto H, Umezu S. Groove fabrication on surface of soft gelatin gel utilizing micro-electrical discharge machining (Micro-EDM)[J]. J. Food Eng., 2020, 277: 109919.
doi: 10.1016/j.jfoodeng.2020.109919
URL
[14] Yang Z W(杨志伟). The manufature of array micro-protrudes and micro-pits in non-traditional machining[D]. Nanjing University of Aeronautics and Astronautics(南京航空航天大学), 2007.
[15]
Baldhoff T, Nock V, Marshall A T. Through-mask electrochemical micromachining of aluminum in phosphoric acid[J]. J. Electrochem. Soc., 2017, 164(9): 194-202.
doi: 10.1149/2.0441709jes
[16]
Schuster R. Electrochemical microstructuring with short voltage pulses[J]. ChemPhysChem, 2007, 8(1): 34-39.
pmid: 17111455
[17] Datta M. Microfabrication by through-mask electrochemical micromachining[M]//Chang S C, Pang S W (Editors). Micromachining and Microfabrication Process Technology III, Proceedings of The Society of Photo-Optical Instrumentation Engineers (SPIE), 1997, 3223: 178-184.
[18] Lu Y N(卢亚娜). Numerical simulation and process study of electrochemical machining through mask for medical micro-channel mold[D]. Dalian University of Technology(大连理工大学), 2017.
[19] Wang Y P(王艳萍). The study of micro-structure array machining based on lithography[D]. Dalian University of Technology(大连理工大学), 2015.
[20]
Wang L, Wang Q D, Hao X Q, Ding Y C, Lu B H. Finite element simulation and experimental study on the through-mask electrochemical micro-machining(EMM) process[J]. Int. J. Adv. Manuf. Technol., 2010, 51: 155-162.
doi: 10.1007/s00170-010-2610-x
URL
[21] Liu J(刘建). Group of micro-holes produced by electrochemical machining with fixed cathode[D]. Nanjing University of Aeronautics and Astronautics(南京航空航天大学), 2008.
[22]
Chun K H, Jin D S, Kim S H, Lee E S. Comparison between wire mesh and plate electrodes during wide-pattern maching on invar fine sheet using through-mask electrochemical micromachining[J]. J. Mech. Sci. Technol., 2017, 31(4): 1851-1859.
doi: 10.1007/s12206-017-0332-9
URL
[23] Chen X L, Qu N S, Li H S. Improvement of dimensional uniformity on micro-dimple arrays generated by electrochemical micromachining with an auxiliary electrode[J]. Int. J. Adv. Manuf. Technol., 2015, 8: 1577-1585.
[24] Zhang J Z(张峻中). Investigation on thickness uniformity of micro parts deposited by near-cathode scanning wire-shape anode electrodeposition[D]. Henan Polytechnic University(河南理工大学), 2019.
[25] Wang J Y(王建业), Xu J W(徐家文). Principle and application of electrochemical machining[M]. Beijing: National Defense Industry Press(国防工业出版社), 2001.
[26] Palli S, Dey S R. Theoretical and experimental study of copper electrodeposition in a modified Hull cell[J]. Int. J. Electrochem., 2016: 3482406.
[27] Zhu H Q(朱和卿). Study on uniformity of electroforming layer of metallic microchannel plate based on micro electroforming process[D]. Dalian University of Technology(大连理工大学), 2019.
[28]
Zhai K, Du L Q, Wen Y K, Wang S X, Cao Q, Zhang X, Liu J S. Fabrication of micro pits based on megasonic assisted through-mask electrochemical micromachining[J]. Ultrasonics, 2020, 100: 105990.
doi: S0041-624X(19)30299-9
pmid: 31479968
[29]
Hume E C, Deen W M, Brown R A. Mass transfer analysis of electrodeposition through polymeric masks[J]. J. Electrochem. Soc., 1984, 131(6): 1251-1258.
doi: 10.1149/1.2115796
URL
[30]
Luo J K, Chu D P, Flewitt A J, Spearing S M, Fleck N A, Milne W I. Uniformity control of Ni thin-film microstructures deposited by through-mask plating[J]. J. Electrochem. Soc., 2005, 152(1): C36-C41.
doi: 10.1149/1.1833320
URL
[31]
Roy S, Pintauro P N. Analysis of mixed natural and forced convection copper deposition below the limiting current[J]. Electrochim. Acta, 1993, 38(10): 1461-1470.
doi: 10.1016/0013-4686(93)80084-D
URL
[32] Zhao M(赵明). Study on the Methods and mechanism of improving the thickness unifrormity of micro electroforming layer[D]. Dalian University of Technology(大连理工大学), 2020.
