Abstract
Ni Mo alloy deposits with (111) preferred orientation was obtained in a solution of 0.22 mol/L NiSO 4·6H 2O, 0.06 mol/L Na 2MoO 4·2H 2O and 0.3 mol/L Na 3C 6H 5O 7·2H 2O in temperature from 25℃ to 50℃,and current densities ranged from 10 mA·cm -2 to 30 mA·cm -2 . The electrodeposition of Ni Mo alloy was studied by cylic voltammetry and potential step experiment. It was shown that Ni Mo alloy is formed by mechanism involving progressive nucleation followed by three dimensional growth of the metal centres. The complex plane impedance plots indicate codeposition of Ni Mo alloy involves the intermediate adion. The growth of (111) plane of crystallite is inhibited with adsorption of (NiOH) ads and MoO 2, So Ni Mo alloy deposit exhibits (111) preferred orientation.
Keywords
Ni Mo alloy electrodeposition, Texture, Electrocrystallization mechanism
Publication Date
1997-05-28
Online Available Date
1997-05-28
Revised Date
1997-05-28
Received Date
1997-05-28
Recommended Citation
Ling Huang, Shukai Xu, Jaoning Tang, Fangzu Yang, Shaomin Zhou.
Mechanism and Texture of Ni Mo Alloy Electrodeposition[J]. Journal of Electrochemistry,
1997
,
3(2): Article 11.
DOI: 10.61558/2993-074X.3114
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol3/iss2/11
References
1ABrenner．ElectrodepositionofAloys．NewYork：AcademicPress，1963，2：4292HHUhlig，PBond，HFeler．CorrosionandPassivityofMo－NiAloyinHydrochloricAcid．J．Elec－trochem．Soc．，1963，110：6503MCherkaoui，EChassaing，KVuQuang．Pulse－platedNi－MoCoatings．PlatingandSurf．Finishing，1987，74（10）：504EChassaing，KVuQuangetal．High－TemperatureNi－MoElectrodepositedAloysStructureandProper－tiesPlatingandSurf．Finishing，Aug．（1990）605许书楷，杨防祖，周绍民．电沉积条件对锌镀层织构的影响．电化学，1995，1（4）：4086RGreef，RPeat，LMPeteretal．InstrumentalMethodsinElectrochemistry．ElisHorwood，Chich－ester，1985：3047BScharifker，GHils．TheroreticalandExperimentalStudiesofMultipleNucleation．1983：7，8798周仲伯，陈永言．电极过程动力学基础教程．武汉：武汉大学出版社，1989：2829EChassing，KVuQuangetal．MechanismofNicke－MolybdenumAloyElectrodepositioninCitrateElectrolytes．J．Appl．Electrochem．，1989，19：839
Included in
Engineering Science and Materials Commons, Materials Chemistry Commons, Materials Science and Engineering Commons, Physical Chemistry Commons
