Abstract
Negative electrode made from Cu microencapsulated hydrogen storage alloy was studied by using cyclic voltammetry method. The results showed that copper as a coating material was of a certain stability in 5 mol/L KOH solution within the range of charge and discharge voltage. But when expanding the sweep voltage, the CV curve showed a pair of distinct oxidation reduction current peaks of Cu 2O formation at E =-0.3 V and Cu 2O reduction at E =-0.6 V. With charging discharging cycles, copper is liable to be oxidized to Cu 2O and further oxidized into CuO 2- 2. When charged again, CuO 2- 2 anion is reduced and Cu is electrodeposited on the sufrace of electroce. In respond to this phenomenon, the electrodeposition process of CuO 2- 2 on the smooth Ni electrode was studied by constant potential step technique. The results showed that the deposition process of copper followed the two dimension instantaneous mechanism.
Keywords
Hydrogen storage alloy, Microencapsulation, Copper, Cyclic voltammetry, Constant potential step technique, Electrodeposition
Publication Date
1997-08-28
Online Available Date
1997-08-28
Revised Date
1997-08-28
Received Date
1997-08-28
Recommended Citation
Dawei Zhang, Huatang Yuan, Huabin Yang, Zuoxiang Zhou, Yunshi Zhang.
Behavior of Copper in Hydrogen Storage Alloy Microencapsulated by Copper[J]. Journal of Electrochemistry,
1997
,
3(3): Article 5.
DOI: 10.61558/2993-074X.3123
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol3/iss3/5
Included in
Engineering Science and Materials Commons, Materials Chemistry Commons, Materials Science and Engineering Commons, Physical Chemistry Commons
