The Effect of Bismuth on Microstructure of the Cathodic Copper Deposition of Copper Electrorefining

Authors

Daorong Lu, Hefei University of Technology, Hefei 230009
Jianxing Lin, Hefei University of Technology, Hefei 230009

Corresponding Author

Daorong Lu

Abstract

The electrocrystal formation, crystal orientation and the chemical composition of the cathodic copper deposition in the presence of Bi³⁺ in the electrolyte of acidified CuSO₄ are studies by scanning electron microscopy, X-ray diffraction, atomic absorption and EDAM. The results indicate that the Bi could′t deposit on cathode when copper electrolysed at common current density i=200 A·mol/L^-2 and t=60 ℃. Bi³⁺ scarcely effected on the crystal orientation (220) of copper deposition. High concentration Bi³⁺ in the electrolyte promoted (220) growth and inhibited the other crystal orientation growth. Bi³⁺ effected on electrocrystal formation and the cell dimension of copper deposition.

Keywords

Bismuth, Copper depostion, Electrocrystal formation, Crystalorientation, Cell dimension

DOI Link

https://doi.org/10.61558/2993-074X.2662

Publication Date

1997-11-28

Online Available Date

1997-11-28

Revised Date

1997-06-23

Received Date

1997-04-22

Recommended Citation

Daorong Lu, Jianxing Lin. The Effect of Bismuth on Microstructure of the Cathodic Copper Deposition of Copper Electrorefining[J]. Journal of Electrochemistry, 1997 , 3(4): 395-400.
DOI: 10.61558/2993-074X.2662
Available at: https://jelectrochem.xmu.edu.cn/journal/vol3/iss4/10