Abstract
The mechanism of electrodeposition of Cu/Co multilayer thin films has been studied by means of potentodynamic sweep, cyclic voltammetry sweep and AC impendance. The results indicated that the copper deposition is mass transfer controlled process and the cobalt deposition is related to the absorbed intermediate species such as Co(OH)ads. The cobalt ions first form Co(OH)ads, then was deoxygenated to cobalt on the electrode surface.
Publication Date
1997-11-28
Online Available Date
1997-11-28
Revised Date
1997-11-28
Received Date
1997-11-28
Recommended Citation
Jiangyun Xue, Jixun Wu, Dejun Yang.
Mechanism of Electrodeposition of Cu/Co Multilayer Thin Films[J]. Journal of Electrochemistry,
1997
,
3(4): Article 11.
DOI: 10.61558/2993-074X.2663
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol3/iss4/11
Included in
Engineering Science and Materials Commons, Materials Chemistry Commons, Materials Science and Engineering Commons, Physical Chemistry Commons
