Studies on Impedance of Acid-copper Electroplating System

Authors

Wen DENG, Chemical Engineering Dept. of Xiangtan Polytechnical University, Hunan 411201
Zhao LIU, Applied Chemistry Dept. of Tianjin University, Tianjin 300072
Xiang-min LIN, Applied Chemistry Dept. of Tianjin University, Tianjin 300072
He-tong GUO, Applied Chemistry Dept. of Tianjin University, Tianjin 300072

Corresponding Author

Wen Deng

Abstract

The impedance characteristics of elementary solution (0.3 mol/L CuSO₄+1.94 mol/L H₂SO₄) and that with the addition of 60 mg/L Cl^-, 300 mg/L OP-21, 30 mg/L PEG, 10 mg/L 2thiazolinyldithiopropane sulfate (self-synthesized additive) are investigated and interpreted in terms of equivalent circuit. The results indicated: (1) Cl^- ion can increase cathodic polarization. (2) A twostep reaction mechanism corresponds to Cu^₂₊ reduction, that is: Cu^₂₊→Cu⁺, Cu⁺→Cu(adsorption)→Cu(lattice), Cu^₂₊ react in different forms of complex ion in sulfuric acidcupric sulfate solution with or without Cl^- ion. (3) cupric redution impedance shows dispersion effect in the solution that contains Cl^- ion.

Keywords

Acid-copper electroplating system, Equivalent circuit, Electrochemical impedance spectrum, Dispersion effect

DOI Link

https://doi.org/10.61558/2993-074X.1358

Publication Date

1998-05-28

Online Available Date

1998-05-28

Revised Date

1997-08-24

Received Date

1997-06-13

Recommended Citation

Wen DENG, Zhao LIU, Xiang-min LIN, He-tong GUO. Studies on Impedance of Acid-copper Electroplating System[J]. Journal of Electrochemistry, 1998 , 4(2): 152-158.
DOI: 10.61558/2993-074X.1358
Available at: https://jelectrochem.xmu.edu.cn/journal/vol4/iss2/2