Studies on Impedance of Acidcopper Electroplating System

Authors

Wen Deng, Dept. of Chem., Fudan University, Shanghai 200433);
Zhao Liu, Chemical Engineering Dept. of Xiangtan Polytechnical University, Hunan 411201)Liu zhaolin Xiang Min Guo Hetong(Applied Chemistry Dept. of Tianjin University, Tianjin 300072);
Xiangmin Lin, Chemical Engineering Dept. of Xiangtan Polytechnical University, Hunan 411201)Liu zhaolin Xiang Min Guo Hetong(Applied Chemistry Dept. of Tianjin University, Tianjin 300072);
Hetong Guo, Chemical Engineering Dept. of Xiangtan Polytechnical University, Hunan 411201)Liu zhaolin Xiang Min Guo Hetong(Applied Chemistry Dept. of Tianjin University, Tianjin 300072);

Abstract

The impedance characteristics of elementary solution (0.3 mol/L CuSO_4+1.94　mol/L　H_2SO_4) and that with the addition of 60 mg/L Cl~-, 300 mg/L OP_21, 30 mg/L PEG, 10 mg/L 2thiazolinyldithiopropane sulfate(self-synthesized additive) are investigated and interpreted in terms of equivalent circuit. The results indicated: (1) Cl~- ion can increase cathodic polarization. (2) A twostep reaction mechanism corresponds to Cu~2+ reduction, that is: Cu~2+→Cu~+, Cu~+→Cu(adsorption)→Cu(lattice), Cu~2+ react in different forms of complex ion in sulfuric acidcupric sulfate solution with or without Cl~- ion. (3) cupric redution impedance shows dispersion effect in the solution that contains Cl~- ion.

DOI Link

https://doi.org/10.61558/2993-074X.1358

Publication Date

1998-05-28

Online Available Date

1998-05-28

Revised Date

1998-05-28

Received Date

1998-05-28

Recommended Citation

Wen Deng, Zhao Liu, Xiangmin Lin, Hetong Guo. Studies on Impedance of Acidcopper Electroplating System[J]. Journal of Electrochemistry, 1998 , 4(2): 152-158.
DOI: 10.61558/2993-074X.1358
Available at: https://jelectrochem.xmu.edu.cn/journal/vol4/iss2/2

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