Abstract
All kinds of current methods for etching metals are reviewed.The electrochemical etching methods among them,including through_mask,scanning electrochemical microscopy,confined etchant layer technique,electrochemical scanning tunneling microscopy and super_short potential pulse,are discussed in detail.The compositive analyses were made for the methods in terms of the processing precision(whether processing in micrometer or nanometer scale),the processing efficiency(the complexity of the procedure,and whether fabricating in batch),the extent of application(mainly refer to the procedure,and whether fabricating in batch),the extent of results was shown that each method has itself advantage and imperfection. The confined etchant layer technique has superiority over other methods in the view of the total effect.
Keywords
Metal etching, electrochemical etching, Confined etchant layer technique, Microfabrication.
Publication Date
2002-05-28
Online Available Date
2002-05-28
Revised Date
2002-05-28
Received Date
2002-05-28
Recommended Citation
Li-min JIANG, Zhong-qun TIAN, Zhu-fang LIU, Bin-wei MAO, Hai-gou HUANG, Jian-jun SUN.
The Electrochemical Etching of Metals[J]. Journal of Electrochemistry,
2002
,
8(2): 139-147.
DOI: 10.61558/2993-074X.1450
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol8/iss2/2
References
[1] PalchettiI ,MarrazzaG ,MasciniM .New procedurestoobtainelectrochemicalsensorsforheavymetaldetec tion[J].AnalyticalLetters,2001,34:813～824.
[2] FurukawaS ,RoyS ,MiyajimaH ,etal.Nickelsurfacemicromachining[C].ProceedingsofSixthinternationalsymposiumonmicromachineandhumanscience.IEEE ,1995,161～162.
[3] AriasF ,OliverSRJ,XuB ,HolmlinRE ,etal.Fabricationofmetallicheatexchangersusingsacrificialpoly mermandrils[J].J .Microelectromechan.Sys.,2001,10:107～112.
[4] WangSA ,LiXH ,WakabayashiK ,etal.Deepreactiveionetchingofleadzirconatetitanateusingsulfurhex afluoridegas[J].J.Am.CeramicSoc.,1999,82:1339～1341.
[5] SuhHJ ,BharathiP ,BeebleDJ ,etal.Dendriticmaterialasadry_releasesacrificiallayer[J].J.Microelec tromechan.Sya.,2000,9:198～205.
[6] LiXH ,AbeT ,EsashiM .DeepreactveionetchingofPyrexglassusingSF6plasma[J].SensorsandActua tors,2001,87:139～145.
[7] TakeuchiS ,ShimoyamaI .Athree_dimensionalshapememoryalloymicroelectrodewithclippingstructureforinsectneuralrecording[J].J .Microelectromachan.Sys.,2000,9:24～31.
[8] SurganovV ,MozalevA ,BokshaV .PlanarizedaluminumsubmicronstructureformationforinterconnectionofULSIbylaserlthographyandelectrochemicalanodizing[J].MicroelectronicEngineering,1997,37/38:335～340.
[9] VossenJL ,KernW .ThinFilmProcesses[M].NewYork:AcademicPress,1991.
[10] ZhuQY ,etal.PrecisionManufacturewithLaser(inChinese)[M ].Beijing:MachineIndustryPress,Beijing,1990.
[11] MorenoOA ,McHattenRC ,PaonessaRS ,etal.inPrinciplesofElectronicPackaging(editedbySeraphimDP ,LaskyRCandLiCY)[M ].NewYork:McGraw_HillBookCompany,1989.
[12] RomankiwLT .Apath:fromelectroplatingthroughlithographicmasksinelectronicstoLIGAinMEMS[J].ElectrochimicaActa,1997,42:2985.
[13] CohenA .SPIE 1999SymposiumonMicromachiningandmicrofabrication[C].SantaClora,CA ,September22,1999.
[14] TheMachineManufactureResearchGroupofHarbinInstituteofTechnology.ElectrolyticMachiningTech nology(inChinese)[M ].Beijing:NationalDefenceIndustryPress,1979.
[15] DattaM .Fabricationofanarrayofprecisionnozzlesbythrough_maskelectrochemicalmicromachining[J].J.Electrochem.Soc.,1995,142:3801～805.
[16] ShenoyRV ,DattaM ,RomankiwLT .Investigationofislandformationduringthrough_maskelectrochemicalmicromachining[J].J.Electrochem.Soc.,1996,143:2306.
[17] MandlerD .,BardA .J .Scanningelectrochemicalmicroscopy:theapplicationofthefeedbackmodeforhighresolutioncopperetching[J].J .Electrochem.Soc.,1989,136:3143～3144.
[18] HusserOE ,CrastonDH ,BardAJ .Scanningelectrochemicalmicroscopy:high_resolutiondepositionandetchingofmetals[J].J .Electrochem.Soc.,1989,136:222～3229.
[19] TianZW ,FengZD ,TianZQ ,etal.Confinedetchantlayertechniquefortwo_dimensionallithographyathighresolutionusingelectrochemicalscanningtunnelingmicroscopy[J].FaradayDiscuss,1992,94:37.
[20] ZuYB ,XieL ,MaoBW ,TianZW .Studiesonsiliconetchingusingtheconfinedetchantlayertechnique[J].ElectrochimicaActa,1998,43:1683.
[21] SunJJ ,HuangHG ,TianZQ ,etal.Three_dimensionalmicromachiningformicrosystemsbyconifnedetchantlayertechnique[J].ElectrochimicaActa,2001,47:95～101.
[22] TianZW ,LinHX ,SunJJ ,etal.Thedevelopmentofmicrosystemsandnweapplicationsofelectrochemistry[J].Electrochemistry(inChinese),2001,7:1～9.
[23] SchusterR ,KirchnerV ,AllongueP ,etal.Electrochemicalmicromachining[J]Science,2000,289:98～101.
[24] StroscioJA ,EiglerDM .Atomicandmolecularmanipulationwiththescanningtunnelingmicroscope[J].Sci ence,1991,254:1319～1326.
[25] SchusterR ,KirchnerV ,XiaXH ,etal.Nanoscaleelectrochemistry[J].Phys.Rev.Lett.,1998,80:5599～5602.
[26] LebretonC ,WangZZ .Criticalhumidityforremovalofatomsfromthegoldsurfacewithscanningtunnelingmicroscopy[J].J .Vac.Sci.technol.,1996,B14:1356～1359.
[27] SugimuraH ,UchidaT ,KitamuraN ,etal.Scanningtunnelingmicroscopetip_introducedanodizationfornanofabricationoftitanium[J].J .Phys.Chem.,1994,98:4352～4357.
[28] XieZX ,KolbDM .SpatiallyconfinedcopperdissolutionbyandSTMtip:anewtypeofelectrochemicalreac tion?[J].JournalofElectroanalyticalChemistry,2000,481:177～182
