XRD Study on Highly Preferred Orientation Cu Electrodeposit

Authors

Min GU, Chemistry Department of Shantou Universitry, Shantou 515063, China; Department of Chemistry,State Key Laboratory for Physical Chemistry of Solid Surfaces, Institute of Physical Chemistry, Xiamen University, Xiamen 361005, ChinaFollow
Fang-zu YANG, Department of Chemistry,State Key Laboratory for Physical Chemistry of Solid Surfaces, Institute of Physical Chemistry, Xiamen University, Xiamen 361005, China
Ling HUANG, Department of Chemistry,State Key Laboratory for Physical Chemistry of Solid Surfaces, Institute of Physical Chemistry, Xiamen University, Xiamen 361005, China
Shi-bing YAO, Department of Chemistry,State Key Laboratory for Physical Chemistry of Solid Surfaces, Institute of Physical Chemistry, Xiamen University, Xiamen 361005, China
Shao-min ZHOU, Department of Chemistry,State Key Laboratory for Physical Chemistry of Solid Surfaces, Institute of Physical Chemistry, Xiamen University, Xiamen 361005, China

Corresponding Author

Min GU(mgu@stu.edu.cn)

Abstract

Copper electrodeposit was obtained in CuSO₄+H₂SO₄ electrolyte solution by electrodeposition and its structure was studied by XRD. The results showed that copper electoddeposits with the highly preferred orientations of (220) and (111) could be obtained at current density 4.0 A/dm² and 15.0 A/dm², respectively. The texture coefficient (TC ) values were increased by thickness of Cu deposits. The thickness would be, to obtain Cu electrodeposit with (111) highly preferred orientation, about 7 times of that of (220) highly preferred orientation, which indicated that(220) face was easier to be remained than (111) face and that electrocrystallization of Cu at low current density would be easier controlled by electrodeposition condition. The higher deposition current density was benefit to nuclei formation. The Cu deposit was presented in the distortion and increase of crystal lattice.

Keywords

Electrodeposition, Cu deposit, Structure

DOI Link

https://doi.org/10.61558/2993-074X.3298

Publication Date

2002-08-28

Online Available Date

2002-08-28

Revised Date

2002-08-20

Received Date

2001-03-05

Recommended Citation

Min GU, Fang-zu YANG, Ling HUANG, Shi-bing YAO, Shao-min ZHOU. XRD Study on Highly Preferred Orientation Cu Electrodeposit[J]. Journal of Electrochemistry, 2002 , 8(3): 282-287.
DOI: 10.61558/2993-074X.3298
Available at: https://jelectrochem.xmu.edu.cn/journal/vol8/iss3/13