Study on the Effect of Additives in the Electrodeposition of Sn-Ag-Cu Ternary Alloy Solder

Authors

Hua Miao, 1. Shennan Circuits Co., Ltd,Guangdong Shenzhen 518023, China;
Ming-Rui Li, 2. School of Materials and Energy, University of Electronic Science and Technology of China, Sichuan Chengdu 610054, China;
Wen-Zhong Zou, 2. School of Materials and Energy, University of Electronic Science and Technology of China, Sichuan Chengdu 610054, China;
Guo-Yun Zhou, 2. School of Materials and Energy, University of Electronic Science and Technology of China, Sichuan Chengdu 610054, China;Follow
Shou-Xu Wang, 2. School of Materials and Energy, University of Electronic Science and Technology of China, Sichuan Chengdu 610054, China;
Xiao-Jing Ye, 1. Shennan Circuits Co., Ltd,Guangdong Shenzhen 518023, China;
Kai Zhu, 1. Shennan Circuits Co., Ltd,Guangdong Shenzhen 518023, China;

Corresponding Author

Guo-Yun Zhou(gzzhou32@uestc.edu.cn)

Abstract

Sn-Ag-Cu ternary alloy is the most ideal substitute for Sn-Pb alloy at present, and can be prepared by electrodeposition with high production efficiency, simple equipment, easy maintenance and excellent coating performance. The coordination system of the electroplating solution was investigated through the Hull cell experiment. The type of brighteners used in the plating solution and the ratio of the two brighteners were determined through the microscopic morphologic characterization, electrochemical corrosion test and cathodic polarization curve test. In addition, the dispersant and stabilizer were studied by observing the microscopic morphology and measuring the concentration change of Sn²⁺ ions in the plating solution, respectively. The results showed that when ammonium citrate and thiourea were used as the complexing agents, benzylidene acetone and polyethylene glycol as the brighteners, poly propylene glycol as the dispersing agent, and ascorbic acid as the stabilizer, the wide current density range of the plating solution and excellent stability were obtained. Furthermore, the resulted coating was dense and smooth with high corrosion resistance.

Graphical Abstract

Keywords

ternary alloy, electrodeposition, additive, Sn-Ag-Cu

DOI Link

https://doi.org/10.13208/j.electrochem.210441

Publication Date

2022-06-28

Online Available Date

2022-06-28

Revised Date

2022-05-30

Received Date

2021-05-06

Recommended Citation

Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zhou, Shou-Xu Wang, Xiao-Jing Ye, Kai Zhu. Study on the Effect of Additives in the Electrodeposition of Sn-Ag-Cu Ternary Alloy Solder[J]. Journal of Electrochemistry, 2022 , 28(6): 2104411.
DOI: 10.13208/j.electrochem.210441
Available at: https://jelectrochem.xmu.edu.cn/journal/vol28/iss6/13

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