Volume 28, Issue 6 (2022) Special Issue on Electronic Electroplating (Ⅰ)
Reviews
Introduction of Development and Application Technology of Organic Additives for Acid Copper Electroplating
Hao-Bin Zou, Chao-Li Tan, Wei Xiong, Dao-Lin Xi, and Bin-Yun Liu
Development Status of Copper Electroplating Filling Technology in Through Glass Via for 3D Interconnections
Zhi-Jing Ji, Hui-Qin Ling, Pei-Lin Wu, Rui-Yi Yu, Da-Quan Yu, and Ming Li
Research Progresses of Cobalt Interconnect and Superfilling by Electroplating in Chips
Li-Jun Wei, Zi-Han Zhou, Yun-Wen Wu, Ming Li, and Su Wang
Articles
Study on Weak Alkaline Cyanide-Free Silver Plating Process for Etching Lead Frame
Jian-Wei Zhao, Hai-Feng Zhu, Xiao-Hui Yu, Gui-Yun Yuan, and Zhi Sun
Influences of Suppressing Additive Malachite Green on Superconformal Cobalt filling and Nucleation
Xiao-Chuan Ma, Ya-Qiang Li, Pei-Xia Yang, Jin-Qiu Zhang, and Mao-Zhong An
Application of Numerical Simulation Method in Periodic Pulse Reverse Electroplating Through Hole
Yuan-Hang Zhang, Mao-Zhong An, Pei-Xia Yang, and Jin-Qiu Zhang
Effect of Sodium Alcohol Thiyl Propane Sulfonate on Electrolysis of High Performance Copper Foil for Lithium Ion Batteries
Sen Yang, Wen-Chang Wang, Ran Zhang, Shui-Ping Qin, Min-Xian Wu, Naotoshi Mitsuzaki, and Zhi-Dong Chen
Optimization of Pulse Plating Additives and Plating Parameters for High Aspect Ratio Through Holes
Kai Yang, Ji-Da Chen, Shi-Jin Chen, Wei-Lian Xu, Mao-Gui Guo, Jin-Chao Liao, and Zeng-Kun Wu
An Investigation on the Interface Corrosion Behaviors of Cobalt Interconnects in Chemical Mechanical Polishing Slurry
Kai-Xuan Qin, Peng-Fei Chang, Yu-Lin Huang, Ming Li, and Tao Hang
Electrochemical SERS study of Benzotriazole and 3-mercapto-1-propanesulfonate in Acidic Solution on Copper Electrode
Yin-Fei Shen, Yan-Li Chen, Sheng-Xu Wang, Ye Zhu, Wen-Chang Wang, Min-Xian Wu, and Zhi-Dong Chen
Study on Low Voltage Electrodeposition of Diamond-like Carbon Film
Li Wang, Min-Xian Wu, Jun Li, Yan-Li Chen, Wen-Chang Wang, and Zhi-Dong Chen
Study on the Effect of Additives in the Electrodeposition of Sn-Ag-Cu Ternary Alloy Solder
Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zhou, Shou-Xu Wang, Xiao-Jing Ye, and Kai Zhu
Viewpoint
Microstructure of Electrodeposited Copper Foil: Discussion on the Mechanism Model of Three-Dimensional Electrocrystallization
Ren-Zhi Liu, Ping-Ling Xie, and Chong Wang
Guest Editor
Ming Li,Shanghai Jiao Tong University Email:mingli90@sjtu.edu.cn
Cover Designers
Min-Xian Wu ,Changzhou University Email:minxian.wu@cczu.edu.cn
Zhi-Dong Chen,Changzhou University Email:zdchen@cczu.edu.cn
