Abstract
The upgrade of the fifth generation (5G) communication technology increases the number of communication backplane layers and the aspect ratio of through holes on the board, making it more difficult to use traditional direct current deposition for interconnection. Direct current electrodeposition is more prone to uneven coating in the hole, resulting in poor contact between the coating and components, and open circuit. This has a serious impact on the stability of printed circuit board. The periodic pulse reverse plating method can significantly improve the uniformity of high aspect ratio through-hole plating and improve the production quality of through-hole plating through the dissolution and electromigration of the coating in the reverse pulse process. Compared with direct current method, periodic reverse pulse has multiple controllable parameters. Changing these parameters will have different effects on the quality of through-hole electroplating. However, to study all parameters one by one, the number of experiments is huge and time-consuming. Numerical simulation is a newly developing research method, which intuitively studies the influence of a variety of physical fields. And it can be completed only by calculation, which avoids the loss of a large number of experiments. In this work, the influences of periodic pulse reverse parameters in through hole electroplating were studied by numerical simulation. Based on the orthogonal experiments, the influence order and rule of the periodic pulse reverse parameters on throwing power (TP) of through hole were analyzed. Among them, the reverse pulse duty ratio has a great influence on the TP of through-hole. The optimal combination is screened as: Forward peak current density 1 A·dm-2, ratio of positive and reverse peak current density 1:4, reverse peak width 1ms, ratio of positive and reverse peak width 30:1, forward duty cycle 1, reverse duty cycle 1, number of forward peak 2, number of reverse peak 3. Using the optimized parameter combination in the simulation results, TP is greatly improved as compared with direct current electrodeposition. The parameters of periodic pulse reverse electroplating optimized by numerical simulation method can effectively improve the uniform plating capacity of through holes, and can be applied to actual electrodeposition of through holes. Using the optimized parameters, the TP of through hole with the aspect ratio of 1:10 is improved efficiently. The experimental results provide theoretical support and new ideas for the optimization of periodic pulse reverse electroplating by numerical simulation method.
Graphical Abstract
Keywords
numerical simulation, through hole electroplating, periodic pulse reverse electroplating, throwing power, orthogonal test
Publication Date
2022-06-28
Online Available Date
2022-06-28
Revised Date
2021-04-10
Received Date
2022-02-28
Recommended Citation
Yuan-Hang Zhang, Mao-Zhong An, Pei-Xia Yang, Jin-Qiu Zhang.
Application of Numerical Simulation Method in Periodic Pulse Reverse Electroplating Through Hole[J]. Journal of Electrochemistry,
2022
,
28(6): 2104511.
DOI: 10.13208/j.electrochem.210451
Available at:
https://jelectrochem.xmu.edu.cn/journal/vol28/iss6/4
References
[1]
Abbaspour R, Brown D K, Bakir M S. Fabrication and electrical characterization of sub-micron diameter through-silicon via for heterogeneous three-dimensional integrated circuits[J]. J. Micromech. Microeng., 2017, 27(2): 025011.
doi: 10.1088/1361-6439/aa544c
URL
[2] Wang Q(王卿), Zhang Y B(张勇斌), Chen J M(陈金明), Wang F(王峰). Effects of current modes on gold electroplating in a citrate system[J]. China Surf. Eng.(中国表面工程), 2019, 32(3): 88-98.
[3] Chang L M(常立民), Chen D(陈丹), Shi S Y(石淑云). Electrochemical study of corrosion resistance of electroplated Zn-Ni alloy coatings[J]. Mater. Protec.(材料保护), 2008, (10): 17-9+3.
[4] Su S D(苏世栋), Ji L X(冀林仙). Copper filling of microvia in printed circuit based on multiphysics coupling[J]. Electr. Comp. Mater.(电子元件与材料), 2018, 37(7): 22-28.
[5] Fei X Y(费翔昱), Gong B K(宫本奎), Dong Z C(董志超), Feng R(冯锐), Sun Y M(孙玉梅), Nie J W(聂继伟). Numerical simulation and experimental study on electrodeposition of copper foil with through holes[J]. Electroplat. Finsh.(电镀与涂饰), 2021, 40(5): 343-351.
[6] Ji L X(冀林仙). Investigaion of copper electrodeposiution for printed-circuit interconnection based on multiphhysics coupling method[D]. Chengdu: University of Electronic Science and Technology of China, 2016.
[7] Fu D G(付定国), Luo H J(罗华江). The simulation of connector parts gold-plated by comsol multiphysics[J]. Guangdong Chem. Ind.(广东化工), 2019, 46(11): 104-106.
[8] Ji L X, Wang S X, Wang C, Chen G Q, Chen Y M, He W, Tan Z. Improved uniformity of conformal through-hole copper electrodeposition by revision of plating cell configuration[J]. J. Electrochem. Soc., 2015, 162(12): D575-D583.
[9] Chen X L(陈雪丽), Wang C(王翀), He W(何为), Zhang W H(张伟华), Chen Y M(陈苑明), Tao Y G(陶应国). Application of periodic pulse reverse plating for through hole interconnection of communication backplane board[J]. Printed Circuit Infor. (印制电路资讯), 2021, 29(5): 7-11.
[10]
Zhu Q S, Zhang X, Liu C Z, Liu H Y. Effect of reverse pulse on additives adsorption and copper filling for through silicon via[J]. J. Electrochem. Soc., 2018, 166(1): D3006-D3012.
doi: 10.1149/2.0021901jes
URL
[11] Xu J M(徐建民), Yan Y F(严艺飞), Yan X S(严新松). Research on electrochemical descaling characteristics based on orthogonal experiment[J]. Mod. Chem. Ind.(现代化工), 2021, 41(10): 172-176.
[12]
Huang B C, Yang C H, Lee C Y, Hu Y L, Hsu C C, Ho C E. Effect of pulse-reverse plating on copper: Thermal mechanical properties and microstructure relationship[J]. Microelectron Reliab., 2019, 96: 71-77.
doi: 10.1016/j.microrel.2019.04.004
URL
