Microstructure of Electrodeposited Copper Foil: Discussion on the Mechanism Model of Three-Dimensional Electrocrystallization

Authors

Ren-Zhi Liu, 1. Wuhan Fengfan Electrochemical technology Co., Ltd., Wuhan 430000, Hubei, China;Follow
Ping-Ling Xie, 2. School of Materials and Energy, University of Electronic Science and technology of China, Chengdu 610054, Sichuan, China;3. Jiangxi Institute of electronic circuits, ShangLi 337009, Jiangxi, China;
Chong Wang, 2. School of Materials and Energy, University of Electronic Science and technology of China, Chengdu 610054, Sichuan, China;3. Jiangxi Institute of electronic circuits, ShangLi 337009, Jiangxi, China;Follow

Corresponding Author

Ren-Zhi Liu(taso@vip.sina.com);
Chong Wang(wangchong@uestc.edu.cn)

Abstract

The manufacturing of electrolytic copper foil has attracted more and more attention with the extensive applications of printed circuit board and lithium battery. The industrial scale is still extending. Compared with the developments of electroplating equipment and electroplating process, there is limited research on the mechanism of electrodeposition. This paper summarizes the manufacturing process of electrodeposited copper foil and analyzes the differences of various electroplating parameters in different electrodeposited copper technologies, and points out the important role of electrodeposition current density in the formation of copper foil. By showing and comparing the microstructures of different electrodeposited copper foils, the influences of various factors in electrodeposition on the microstructures of copper foils and the corresponding macroscopic mechanical properties are discussed. From previous research results, it is found that the electrodeposition conditions and the composition of the plating solution have a significant impact on the microstructure and morphology of the copper foil, as well as the macroscopic mechanical properties. It is difficult to establish an effective relationship between the microstructures such as crystallite size and plane and the mechanical properties, which brings great challenge to the theoretical framework of the macro-mechanical properties of copper foils by using the microstructure of the coating as a bridge to establish electrodeposition conditions. Much effort has been tried to solve this problem by studying the mechanism of copper foil electrodeposition. The classical metal electrodeposition theory reveals that increasing the overpotential can increase the number of instantaneous nucleation and reduce the average grain size, however, it cannot explain the preferred orientation in crystallization. Watanabe found the similarity between electrodeposition and metallurgy, and believed that the microstructure of electrodeposited metal is related to the melting point of the metal, but this “microstructure control” theory still has some defects, such as the inability to explain the refining effect of additives on grains, etc. The author suggests that the relationship between the electrodeposition mechanism and the macroscopic properties of copper foil can be reshaped from the perspectives of valence bond and energy band theory. Influence of the macroscopic properties of copper foil can then be discussed.

Graphical Abstract

Keywords

over-potential, current density, electronic copper foil, microstructure, physical property

DOI Link

https://doi.org/10.13208/j.electrochem.210448

Publication Date

2022-06-28

Online Available Date

2022-06-28

Revised Date

2022-03-14

Received Date

2021-12-28

Recommended Citation

Ren-Zhi Liu, Ping-Ling Xie, Chong Wang. Microstructure of Electrodeposited Copper Foil: Discussion on the Mechanism Model of Three-Dimensional Electrocrystallization[J]. Journal of Electrochemistry, 2022 , 28(6): 2104481.
DOI: 10.13208/j.electrochem.210448
Available at: https://jelectrochem.xmu.edu.cn/journal/vol28/iss6/7