Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution

Authors

Xiao-Li Wang, 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China;
Wei He, 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China;
Xian-Ming Chen, 2. Zhuhai ACCESS Semiconductor Co., Ltd, Zhuhai 519175, Guangdong, China;
Hong Zeng, 3. Delton Technology (Guangzhou) Co., Ltd, Guangzhou 510735, Guangdong, China;
Yuan-Zhang Su, 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China;
Chong Wang, 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China;
Gao-Sheng Li, 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China;
Ben-Xia Huang, 2. Zhuhai ACCESS Semiconductor Co., Ltd, Zhuhai 519175, Guangdong, China;
Lei Feng, 2. Zhuhai ACCESS Semiconductor Co., Ltd, Zhuhai 519175, Guangdong, China;
Gao Huang, 2. Zhuhai ACCESS Semiconductor Co., Ltd, Zhuhai 519175, Guangdong, China;
Yuan-Ming Chen, 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China;Follow

Corresponding Author

Yuan-Ming Chen(ymchen@uestc.edu.cn)

Abstract

The chemical compounds of 2-mercaptobenzothiazole (2-MBT), benzotriazole (BTA) and phenoxyethanol (MSDS) as corrosion inhibitors were used to inhibit the copper etching to form the thick copper line of PCB in the acidic etching solution. The inhibition status was characterized with contact angle measurement, electrochemical test and etch factor calculation, while the corrosion morphology of copper surface was studied by scanning electron microscope. The adsorption mechanism of corrosion inhibitors on copper surface is analyzed by molecular dynamics and quantum chemistry calculations. The results indicated that the synergistic function of the two inhibitors could effectively promote their adsorption on the copper surface in parallel, while their adsorption energy could be higher than that of the single inhibitor. The etch factor of the thick copper line with about 33 μm in thickness increased to 6.59 from the etching solution with 2-MBT and MSDS for good agreement of PCB manufacture.

Graphical Abstract

Keywords

corrosion inhibitor, synergistic function, thick copper line, acidic etching solution

DOI Link

https://doi.org/10.13208/j.electrochem.2213007

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.

Publication Date

2022-07-28

Online Available Date

2022-05-17

Revised Date

2022-04-14

Received Date

2022-03-04

Recommended Citation

Xiao-Li Wang, Wei He, Xian-Ming Chen, Hong Zeng, Yuan-Zhang Su, Chong Wang, Gao-Sheng Li, Ben-Xia Huang, Lei Feng, Gao Huang, Yuan-Ming Chen. Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution[J]. Journal of Electrochemistry, 2022 , 28(7): 2213007.
DOI: 10.13208/j.electrochem.2213007
Available at: https://jelectrochem.xmu.edu.cn/journal/vol28/iss7/4