Volume 29, Issue 8 (2023)

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Synthesis and Evaluation of Organic Additives for Copper Electroplating of Interconnects
Yue-Hui Zhai, Yi-Xiao Peng, Yan Hong, Yuan-Ming Chen, Guo-Yun Zhou, Wei He, Peng-Ju Wang, Xian-Ming Chen, and Chong Wang

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Effect of Amine Additives on Thermal Runaway Inhibition of SiC||NCM811 Batteries
Bo-Wen Hou, Long He, Xu-Ning Feng, Wei-Feng Zhang, Li Wang, and Xiang-Ming He

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Pulse Electroplating of Nanotwinned Copper Using MPS-PEG Two-Additive System for Damascene via Filling Process
Yu-Xi Wang, Li-Yin Gao, Yong-Qiang Wan, Zhe Li, and Zhi-Quan Liu

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Effects of Traps on Photo-induced Interfacial Charge Transfer of Ag-TiO₂: Photoelectrochemical, Electrochemical and Spectroscopic Characterizations
Zhi-Hao Liang, Jia-Zheng Wang, Dan Wang, Jian-Zhang Zhou, and De-Yin Wu