Synthesis and Evaluation of Organic Additives for Copper Electroplating of Interconnects

Authors

Yue-Hui Zhai, School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China
Yi-Xiao Peng, School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China
Yan Hong, School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China; Research Center for Electronic Circuits of Jiangxi, Pingxiang 337009, Jiangxi, China
Yuan-Ming Chen, Founder Technology High Density Electronics Co., LTD, Zhuhai 519070, Guangdong, China
Guo-Yun Zhou, School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China; Research Center for Electronic Circuits of Jiangxi, Pingxiang 337009, Jiangxi, China
Wei He, Founder Technology High Density Electronics Co., LTD, Zhuhai 519070, Guangdong, China
Peng-Ju Wang, Mingfeng Electronic Material Technology Co., LTD, Liyang 213341, Jiangsu, China
Xian-Ming Chen, Zhuhai ACCESS Semiconductor Co., Ltd, Zhuhai 519099, Guangdong, China
Chong Wang, School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China; Research Center for Electronic Circuits of Jiangxi, Pingxiang 337009, Jiangxi, ChinaFollow

Corresponding Author

Chong Wang(wangchong@uestc.edu.cn)

Abstract

Copper interconnects are essential to the functionality, performance, power efficiency, reliability, and fabrication yield of electronic devices. They are widely found in chips, packaging substrates and printed circuit boards, and are often produced by copper electroplating in an acidic aqueous solution. Organic additives play a decisive role in regulating copper deposition to fill microgrooves, and micro-vias to form fine lines and interlayer interconnects. Generally, an additive package consists of three components (brightener, suppressor, and leveler), which have a synergistic effect of super-filling on electroplating copper when the concentration ratio is appropriate. Many works of literature have discussed the mechanism of super filling and the electrochemical behavior of representative additive molecules; however, few articles discussed the chemical structure and preparation of the additives. Herein, this paper focuses on the preparation method and the rapid electrochemical screening of each additive component to provide an idea for the future development of copper electroplating additives.

Graphical Abstract

Keywords

acid copper electroplating; copper interconnect; suppressor; brightener; leveler

DOI Link

https://doi.org/10.13208/j.electrochem.2208111

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.

Publication Date

2023-08-28

Online Available Date

2023-01-07

Revised Date

2022-10-17

Received Date

2022-08-11

Recommended Citation

Yue-Hui Zhai, Yi-Xiao Peng, Yan Hong, Yuan-Ming Chen, Guo-Yun Zhou, Wei He, Peng-Ju Wang, Xian-Ming Chen, Chong Wang. Synthesis and Evaluation of Organic Additives for Copper Electroplating of Interconnects[J]. Journal of Electrochemistry, 2023 , 29(8): 2208111.
DOI: 10.13208/j.electrochem.2208111
Available at: https://jelectrochem.xmu.edu.cn/journal/vol29/iss8/1