Volume 32, Issue 2 (2026)
Review
Current Research Progress on Electrode Materials for All-Vanadium Redox Flow Batteries
Wen-Qi Wang, Jie Jin, Li-Min Wang, Xin-Yue Liu, Tao Cheng, Yong Hou, Han Xue, Zhi-Yu Wang, Bo Liu, Jia-Bao Liu, and Xu-Bin Lu
Articles
Triphenylmethane-Derived Levelers for High-Speed Redistribution Layer Copper Electroplating of Tailored Surface Morphologies
Zi-Hao Song, Wei-Bin Wang, Xiao-Hui Liu, Xiao-Min Han, Yi Zhou, Rui Huang, Yan-Xia Jiang, Zhe Li, Xiao-Wei Liu, Mei-Ling Xiao, Hong-Gang Liao, Wei-Lin Xu, and Rong Sun
An Electrochemiluminescence-Based Arsenic (III) Sensor using Luminol on Screen-Printed Gold Electrodes
Harmesa Harmesa, Isnaini Rahmawati, Andrea Fiorani, Yasuaki Einaga, Eny Kusrini, A’an Johan Wahyudi, Asep Saefumillah, and Tribidasari A Ivandini
Control of Pore Nucleation and Rearrangement Kinetics During Aluminium Anodizing in Phosphoric Acid Electrolyte
Ilya V. Roslyakov, Nikita A. Shirin, Dmitry M. Tsymbarenko, Sergei N. Pavlov, Sergey E. Kushnir, Nikolay V. Lyskov, and Kirill S. Napolskii
About the Cover
Prof. Rong Sun and the team at Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (CAS), in collaboration with Xiamen University and the Changchun Institute of Applied Chemistry, CAS, reported the application performance and interfacial mechanism of a dye-based leveler methyl green in redistribution layers (RDL) copper electroplating for wafer-level packaging, achieving tailored surface morphology of copper traces at high electroplating current densities. View the Article.
